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430 数据表(PDF) 3 Page - Intel Corporation |
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430 数据表(HTML) 3 Page - Intel Corporation |
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3 / 71 page ![]() Datasheet 3 Contents 1Introduction ..............................................................................................................7 1.1 Terminology .......................................................................................................8 1.2 References .........................................................................................................9 2 Low Power Features ................................................................................................ 11 2.1 Clock Control and Low Power States .................................................................... 11 2.1.1 Core Low-Power States ........................................................................... 12 2.1.2 Package Low Power States ...................................................................... 13 2.2 FSB Low Power Enhancements ............................................................................ 15 2.3 Processor Power Status Indicator (PSI#) Signal..................................................... 16 3 Electrical Specifications ........................................................................................... 17 3.1 FSB (Front Side Bus) and GTLREF........................................................................ 17 3.2 Power and Ground Pins ...................................................................................... 17 3.3 Decoupling Guidelines........................................................................................ 17 3.3.1 VCC Decoupling...................................................................................... 18 3.3.2 FSB AGTL+ Decoupling ........................................................................... 18 3.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking........................................... 18 3.4 Voltage Identification and Power Sequencing ........................................................ 18 3.5 Catastrophic Thermal Protection .......................................................................... 22 3.6 Signal Terminations and Unused Pins ................................................................... 22 3.7 FSB Frequency Select Signals (BSEL[2:0])............................................................ 23 3.8 FSB Signal Groups............................................................................................. 23 3.9 CMOS Signals ................................................................................................... 25 3.10 Maximum Ratings.............................................................................................. 25 3.11 Processor DC Specifications ................................................................................ 25 4 Package Mechanical Specifications and Pin Information .......................................... 31 4.1 Processor Component Keep-Out Zones................................................................. 31 4.2 Package Loading Specifications ........................................................................... 31 4.3 Processor Mass Specifications ............................................................................. 31 4.4 Processor Pinout and Pin List .............................................................................. 36 4.5 Alphabetical Signals Reference ............................................................................ 55 5 Thermal Specifications and Design Considerations .................................................. 63 5.1 Thermal Specifications ....................................................................................... 65 5.1.1 Thermal Diode ....................................................................................... 65 5.1.2 Thermal Diode Offset .............................................................................. 68 5.1.3 Intel® Thermal Monitor........................................................................... 68 5.1.4 Digital Thermal Sensor............................................................................ 70 5.1.5 Out of Specification Detection .................................................................. 70 5.1.6 PROCHOT# Signal Pin ............................................................................. 70 |
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