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430 数据表(PDF) 3 Page - Intel Corporation

部件名 430
功能描述  Celeron M Processor on 65 nm Process
PDF  71 Pages
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制造商  INTEL [Intel Corporation]
网页  http://www.intel.com
标志 INTEL - Intel Corporation

430 数据表(HTML) 3 Page - Intel Corporation

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Datasheet
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Contents
1Introduction ..............................................................................................................7
1.1
Terminology .......................................................................................................8
1.2
References .........................................................................................................9
2
Low Power Features ................................................................................................ 11
2.1
Clock Control and Low Power States .................................................................... 11
2.1.1
Core Low-Power States ........................................................................... 12
2.1.2
Package Low Power States ...................................................................... 13
2.2
FSB Low Power Enhancements ............................................................................ 15
2.3
Processor Power Status Indicator (PSI#) Signal..................................................... 16
3
Electrical Specifications ........................................................................................... 17
3.1
FSB (Front Side Bus) and GTLREF........................................................................ 17
3.2
Power and Ground Pins ...................................................................................... 17
3.3
Decoupling Guidelines........................................................................................ 17
3.3.1
VCC Decoupling...................................................................................... 18
3.3.2
FSB AGTL+ Decoupling ........................................................................... 18
3.3.3
FSB Clock (BCLK[1:0]) and Processor Clocking........................................... 18
3.4
Voltage Identification and Power Sequencing ........................................................ 18
3.5
Catastrophic Thermal Protection .......................................................................... 22
3.6
Signal Terminations and Unused Pins ................................................................... 22
3.7
FSB Frequency Select Signals (BSEL[2:0])............................................................ 23
3.8
FSB Signal Groups............................................................................................. 23
3.9
CMOS Signals ................................................................................................... 25
3.10 Maximum Ratings.............................................................................................. 25
3.11 Processor DC Specifications ................................................................................ 25
4
Package Mechanical Specifications and Pin Information .......................................... 31
4.1
Processor Component Keep-Out Zones................................................................. 31
4.2
Package Loading Specifications ........................................................................... 31
4.3
Processor Mass Specifications ............................................................................. 31
4.4
Processor Pinout and Pin List .............................................................................. 36
4.5
Alphabetical Signals Reference ............................................................................ 55
5
Thermal Specifications and Design Considerations .................................................. 63
5.1
Thermal Specifications ....................................................................................... 65
5.1.1
Thermal Diode ....................................................................................... 65
5.1.2
Thermal Diode Offset .............................................................................. 68
5.1.3
Intel® Thermal Monitor........................................................................... 68
5.1.4
Digital Thermal Sensor............................................................................ 70
5.1.5
Out of Specification Detection .................................................................. 70
5.1.6
PROCHOT# Signal Pin ............................................................................. 70



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