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MPC8358ECVVADDGA 数据表(PDF) 56 Page - Freescale Semiconductor, Inc |
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MPC8358ECVVADDGA 数据表(HTML) 56 Page - Freescale Semiconductor, Inc |
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56 / 102 page ![]() MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5 56 Freescale Semiconductor TDM/SI DC Electrical Characteristics 17 TDM/SI This section describes the DC and AC electrical specifications for the time-division-multiplexed and serial interface of the MPC8360E/58E. 17.1 TDM/SI DC Electrical Characteristics This table provides the DC electrical characteristics for the device TDM/SI. 17.2 TDM/SI AC Timing Specifications This table provides the TDM/SI input and output AC timing specifications. This figure provides the AC test load for the TDM/SI. Figure 44. TDM/SI AC Test Load Figure 45 represents the AC timing from Table 56. Note that although the specifications generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge is the active edge. Table 57. TDM/SI DC Electrical Characteristics Characteristic Symbol Condition Min Max Unit Output high voltage VOH IOH = –2.0 mA 2.4 — V Output low voltage VOL IOL = 3.2 mA — 0.5 V Input high voltage VIH —2.0 OVDD + 0.3 V Input low voltage VIL —–0.3 0.8 V Input current IIN 0 V ≤VIN ≤OVDD —±10 μA Table 58. TDM/SI AC Timing Specifications1 Characteristic Symbol2 Min Max3 Unit TDM/SI outputs—External clock delay tSEKHOV 210 ns TDM/SI outputs—External clock high impedance tSEKHOX 210 ns TDM/SI inputs—External clock input setup time tSEIVKH 5— ns TDM/SI inputs—External clock input hold time tSEIXKH 2— ns Notes: 1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings are measured at the pin. 2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tSEKHOX symbolizes the TDM/SI outputs external timing (SE) for the time tTDM/SI memory clock reference (K) goes from the high state (H) until outputs (O) are invalid (X). 3. Timings are measured from the positive or negative edge of the clock, according to SIxMR [CE] and SITXCEI[TXCEIx]. Refer MPC8360E Integrated Communications Processor Reference Manual for more details. Output Z0 = 50 Ω OVDD/2 RL = 50 Ω |
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