MPC8358ECVVADDGA datasheet(63/102 Pages) FREESCALE

部件名	MPC8358ECVVADDGA

功能描述	PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

PDF	102 Pages

Scroll/Zoom	100%

制造商	FREESCALE [Freescale Semiconductor, Inc]

网页	http://www.freescale.com

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63 / 102 page

MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5

Freescale Semiconductor

Package Parameters for the TBGA Package

Package and Pin Listings

This section details package parameters, pin assignments, and dimensions. The MPC8360E/58E is available in a tape ball grid

array (TBGA), see Section 20.1, “Package Parameters for the TBGA Package,” and Section 20.2, “Mechanical Dimensions of

the TBGA Package,” for information on the package.

20.1

Package Parameters for the TBGA Package

The package parameters for rev. 2.0 silicon are as provided in the following list. The package type is 37.5 mm

× 37.5 mm, 740

tape ball grid array (TBGA).

Package outline

37.5 mm

× 37.5 mm

Interconnects

740

Pitch

1.00 mm

Module height (typical)

1.46 mm

Solder Balls

62 Sn/36 Pb/2 Ag (ZU package)

95.5 Sn/0.5 Cu/4Ag (VV package)

Ball diameter (typical)

0.64 mm

MPC8358ECVVADDGA 数据表(PDF) 63 Page - Freescale Semiconductor, Inc