MPC8358ECVVADDGA datasheet(10/102 Pages) FREESCALE

10 / 102 page

MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5

Freescale Semiconductor

Overall DC Electrical Characteristics

This figure shows the undershoot and overshoot voltages at the interfaces of the device.

Figure 3. Overshoot/Undershoot Voltage for GVDD/OVDD/LVDD

PCI, local bus, DUART, system control and power management, I2C,

SPI, and JTAG I/O voltage

OVDD

3.3 V ± 330 mV

—

Junction temperature

0 to 105

–40 to 105

° C

Notes:

1. GVDD, LVDD, OVDD, AVDD, and VDD must track each other and must vary in the same direction—either in the positive or

negative direction.

2. The operating conditions for junction temperature, TJ, on the 600/333/400 MHz and 500/333/500 MHz on rev. 2.0 silicon is

° to 70 ° C. Refer to Errata General9 in Chip Errata for the MPC8360E, Rev. 1.

3. For more information on Part Numbering, refer to Table 80.

Table 2. Recommended Operating Conditions (continued)

Characteristic

Symbol

Recommended

Value

Unit

Notes

GND

GND – 0.3 V

GND – 0.7 V

Not to Exceed 10%

G/L/OVDD + 20%

G/L/OVDD

G/L/OVDD + 5%

of tinterface

1. Note that tinterface refers to the clock period associated with the bus clock interface.

VIH

VIL

Note:

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