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MPC8358ECVVADDGA 数据表(PDF) 94 Page - Freescale Semiconductor, Inc |
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MPC8358ECVVADDGA 数据表(HTML) 94 Page - Freescale Semiconductor, Inc |
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94 / 102 page  MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5 94 Freescale Semiconductor Thermal Management Information This table shows heat sinks and junction-to-ambient thermal resistance for TBGA package. Accurate thermal design requires thermal modeling of the application environment using computational fluid dynamics software which can model both the conduction cooling and the convection cooling of the air moving through the application. Simplified thermal models of the packages can be assembled using the junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More detailed thermal models can be made available on request. Heat sink vendors include the following: Aavid Thermalloy 603-224-9988 80 Commercial St. Concord, NH 03301 Internet: www.aavidthermalloy.com Alpha Novatech 408-749-7601 473 Sapena Ct. #15 Santa Clara, CA 95054 Internet: www.alphanovatech.com International Electronic Research Corporation (IERC) 818-842-7277 413 North Moss St. Burbank, CA 91502 Internet: www.ctscorp.com Table 78. Heat Sinks and Junction-to-Ambient Thermal Resistance of TBGA Package Heat Sink Assuming Thermal Grease Airflow 35 × 35 mm TBGA Junction-to-Ambient Thermal Resistance AAVID 30 × 30 × 9.4 mm pin fin Natural convention 10.7 AAVID 30 × 30 × 9.4 mm pin fin 1 m/s 6.2 AAVID 30 × 30 × 9.4 mm pin fin 2 m/s 5.3 AAVID 31 × 35 × 23 mm pin fin Natural convention 8.1 AAVID 31 × 35 × 23 mm pin fin 1 m/s 4.4 AAVID 31 × 35 × 23 mm pin fin 2 m/s 3.7 Wakefield, 53 × 53 × 25 mm pin fin Natural convention 5.4 Wakefield, 53 × 53 × 25 mm pin fin 1 m/s 3.2 Wakefield, 53 × 53 × 25 mm pin fin 2 m/s 2.4 MEI, 75 × 85 × 12 no adjacent board, extrusion Natural convention 6.4 MEI, 75 × 85 × 12 no adjacent board, extrusion 1 m/s 3.8 MEI, 75 × 85 × 12 no adjacent board, extrusion 2 m/s 2.5 MEI, 75 × 85 × 12 mm, adjacent board, 40 mm side bypass 1 m/s 2.8 |
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