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MPC8358ECVVADDGA 数据表(PDF) 100 Page - Freescale Semiconductor, Inc

部件名 MPC8358ECVVADDGA
功能描述  PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
PDF  102 Pages
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制造商  FREESCALE [Freescale Semiconductor, Inc]
网页  http://www.freescale.com
标志 FREESCALE - Freescale Semiconductor, Inc

MPC8358ECVVADDGA 数据表(HTML) 100 Page - Freescale Semiconductor, Inc

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MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
100
Freescale Semiconductor
Part Numbers Fully Addressed by this Document
25
Document Revision History
This table provides a revision history for this document.
MPC8358E
TBGA
0x804A_0020
0x804A_0021
MPC8358
TBGA
0x804B_0020
0x804B_0021
Table 82. Revision History
Rev.
Number
Date
Substantive Change(s)
5
09/2011
• Section 2.2.1, “Power-Up Sequencing”, added the current limitation “3A to 5A” for the excessive current.
• Section 2.1.2, “Power Supply Voltage Specification, Updated the Characteristic for TBGA (MPC8358 &
MPC8360 Device) with specific frequency for Core and PLL voltages.
• Added table footnote 3 to Table 2.
• Applied table footnotes 1 and 2 to Table 10.
• Removed table footnotes from Table 19.
• Applied table footnote 8 to the last row of Table 40.
• Applied table footnotes 8 and 9 to Table 41.
• Applied table footnotes 2and 3 to Table 45.
• Removed table footnotes from Table 46.
• Applied table footnote to last three rows of Table 65.
4
01/2011
• Updated references to the LCRR register throughout
• Removed references to DDR DLL mode in Section 6.2.2, “DDR and DDR2 SDRAM Output AC Timing
Specifications.”
• Changed “Junction-to-Case” to “Junction-to-Ambient” in Section 22.2.4, “Heat Sinks and
Junction-to-Ambient Thermal Resistance,” and Table 78, “Heat Sinks and Junction-to-Ambient Thermal
Resistance of TBGA Package,” titles.
Table 81. SVR Settings (continued)
Device
Package
SVR
(Rev. 2.0)
SVR
(Rev. 2.1)



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