AR0330 datasheet(49/77 Pages) ONSEMI

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AR0330: 1/3-Inch CMOS Digital Image Sensor

Subsampling

AR0330_DS Rev. U Pub. 4/15 EN

©Semiconductor Components Industries, LLC,2015.

Subsampling

The AR0330 supports subsampling. Subsampling allows the sensor to read out a smaller

set of active pixels by either skipping or binning pixels within the readout window. The

working modes described in the data sheet that use subsampling are configured to use

either 2x2 or 3x3 subsampling.

Figure 33: Horizontal Binning in the AR0330 Sensor

Horizontal binning is achieved either in the pixel readout or the digital readout. The

sensor will sample the combined 2x or 3x adjacent pixels within the same color plane.

Figure 34: Vertical Row Binning in the AR0330 Sensor

Vertical row binning is applied in the pixel readout. Row binning can be configured of 2x

or 3x rows within the same color plane. ON Semiconductor recommends not to use 3x

binning in AR0330 as it may introduce some image artifacts.

Pixel skipping can be configured up to 2x and 3x in both the x-direction and y-direction.

Skipping pixels in the x-direction will not reduce the row time. Skipping pixels in the y-

direction will reduce the number of rows from the sensor effectively reducing the frame

time. Skipping will introduce image artifacts from aliasing.

The sensor increments its x and y address based on the x_odd_inc and y_odd_inc value.

The value indicates the addresses that are skipped after each pair of pixels or rows has

been read.

The sensor will increment x and y addresses in multiples of 2. This indicates that a

GreenR and Red pixel pair will be read together. As well, that the sensor will read a Gr-R

row first followed by a B-Gb row.

(EQ 16)

lsb

x subsampling factor

x_odd_inc

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AR0330 数据表(PDF) 49 Page - ON Semiconductor