AR0330_DS Rev. U Pub. 4/15 EN

74

©Semiconductor Components Industries, LLC,2015.

AR0330: 1/3-Inch CMOS Digital Image Sensor

Revision History

Rev. P . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10/17/12

• Updated “Features” on page 1

• Table 1, “Available Part Numbers,” on page 1

• Updated Figure 1: “Block Diagram,” on page 6

• Updated Figure 51: “Image Orientation With Relation To Camera Lens,” on page 72

Rev. N . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5/29/12

• Removed Parallel/MIPI information:

– deleted Table 7, “CSP (Parallel/MIPI) Package Pinout,” on page 14

– deleted

Rev. M. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2/17/12

• Updated Table 6, “CSP (HiSPi/MIPI) Package Pinout,” on page 13

• Updated Table 7, “CSP (Parallel/MIPI) Package Pinout,” on page 14

• Updated Table 9, “DC Electrical Definitions and Characteristics (MIPI Mode),” on

page 18

• Updated trademarks

Rev. L . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12/22/11

• Updated title of Figure 3: “Typical Configuration: Serial MIPI,” on page 9

• Changed title of Table 5, “Pin Descriptions” to “CLCC Package Pinout”

• Replaced Table 6, “CSP Package Pin Descriptions” with Table 6, CSP (HiSPi/MIPI)

Package Pinout and Table 7, “CSP (Parallel/MIPI) Package Pinout,” on page 14

• Updated “Packages” on page 69

• Replaced Figure 52, CSP Package with Figure 50: “CSP HiSPi Package,” on page 70 and

Figure 53: “CSP Parallel/MIPI Package Outline Drawing,” on page 74

• Replaced Table 44, “CSP Package Dimensions” with Table 46, CSP (MIPI/HiSPi)

Package Dimensions and Table 46, “CSP (MIPI/HiSPi) Package Dimensions,” on

page 71

Rev. K . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10/26/11

• Updated to Production

• Updated Table 1, “Available Part Numbers,” on page 1

• Updated Table 1, “Key Parameters,” on page 1

• Updated Figure 1: “Block Diagram,” on page 6

• Updated Table 4, “Available Working Modes in the AR0330 Sensor,” on page 7

• Updated notes for Figure 2: “Typical Configuration: Serial Four-Lane HiSPi Interface,”

on page 8

• Updated notes for Figure 3: “Typical Configuration: Serial MIPI,” on page 9

• Updated notes for Figure 4: “Typical Configuration: Parallel Pixel Data Interface,” on

page 10

• Updated Table 5, “Pin Descriptions,” on page 12

• Updated “Power-Up Sequence” on page 15

• Updated Figure 6: “Power Up,” on page 15

• Updated Table 7, “Power-Up Sequence,” on page 16

• Updated “Power-Down Sequence” on page 17

• Updated Table 8, “Power-Down Sequence,” on page 17

• Updated Figure 7: “Power Down,” on page 17

• Added Table 9, “DC Electrical Definitions and Characteristics (MIPI Mode),” on

page 18