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AR0330 数据表(PDF) 72 Page - ON Semiconductor |
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AR0330 数据表(HTML) 72 Page - ON Semiconductor |
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72 / 77 page  AR0330_DS Rev. U Pub. 4/15 EN 72 ©Semiconductor Components Industries, LLC,2015. AR0330: 1/3-Inch CMOS Digital Image Sensor Package Orientation in Camera Design Package Orientation in Camera Design In a camera design, the package should be placed in a PCB so that the first clear pixel is located at the bottom left of the package (look at the package). This orientation will ensure that the image captured using a lens will be oriented correctly. Figure 51: Image Orientation With Relation To Camera Lens The package pin locations after the sensor has been oriented correctly can be shown below. Figure 52: First Clear Pixel and Pin Location (Looking Down on Cover Glass) (2304,1536) First clear pixel (0,0) A - - ----- - --H Pixel Array (0,0) (2304,1536) First clear pixel Pixel Array CSP Package CLCC Package 1 48 Pin Orientation |
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