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AR0330 数据表(PDF) 38 Page - ON Semiconductor

部件名 AR0330
功能描述  CMOS Digital Image Sensor
PDF  77 Pages
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制造商  ONSEMI [ON Semiconductor]
网页  http://www.onsemi.com
标志 ONSEMI - ON Semiconductor

AR0330 数据表(HTML) 38 Page - ON Semiconductor

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AR0330_DS Rev. U Pub. 4/15 EN
38
©Semiconductor Components Industries, LLC,2015.
AR0330: 1/3-Inch CMOS Digital Image Sensor
Pixel Output Interfaces
HiSPi Physical Layer
The HiSPi physical layer is partitioned into blocks of four data lanes and an associated
clock lane. Any reference to the PHY in the remainder of this document is referring to
this minimum building block.
The PHY will serialize a 10-, 12-, 14- or 16-bit data word and transmit each bit of data
centered on a rising edge of the clock, the second on the falling edge of clock. Figure 22
shows bit transmission. In this example, the word is transmitted in order of MSB to LSB.
The receiver latches data at the rising and falling edge of the clock.
Figure 22:
Timing Diagram
DLL Timing Adjustment
The specification includes a DLL to compensate for differences in group delay for each
data lane. The DLL is connected to the clock lane and each data lane, which acts as a
control master for the output delay buffers. Once the DLL has gained phase lock, each
lane can be delayed in 1/8 unit interval (UI) steps. This additional delay allows the user
to increase the setup or hold time at the receiver circuits and can be used to compensate
for skew introduced in PCB design.
If the DLL timing adjustment is not required, the data and clock lane delay settings
should be set to a default code of 0x000 to reduce jitter, skew, and power dissipation.
Figure 23:
Block Diagram of DLL Timing Adjustment
cp
dn
….
….
MSB
LSB
TxPost
dp
cn
1 UI
TxPre
delay
delay
delay
delay
delay
data _lane 0
data _lane 1 clock _lane 0 data _lane 2 data _lane 3



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