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AR0330 数据表(PDF) 71 Page - ON Semiconductor

部件名 AR0330
功能描述  CMOS Digital Image Sensor
PDF  77 Pages
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制造商  ONSEMI [ON Semiconductor]
网页  http://www.onsemi.com
标志 ONSEMI - ON Semiconductor

AR0330 数据表(HTML) 71 Page - ON Semiconductor

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AR0330_DS Rev. U Pub. 4/15 EN
71
©Semiconductor Components Industries, LLC,2015.
AR0330: 1/3-Inch CMOS Digital Image Sensor
Packages
Table 46:
CSP (MIPI/HiSPi) Package Dimensions
Parameter
Symbol
Nominal
Min
Max
Nominal
Min
Max
Millimeters
Inches
Package Body Dimension X
A
6.278
6.253
6.303
0.247
0.246
0.248
Package Body Dimension Y
B
6.648
6.623
6.673
0.262
0.261
0.263
Package Height
C
0.700
0.645
0.745
0.028
0.025
0.029
Cavity height (glass to pixel distance)
C4
0.041
0.037
0.045
0.002
0.001
0.002
Glass Thickness
C3
0.400
0.390
0.410
0.016
0.015
0.016
Package Body Thickness
C2
0.570
0.535
0.605
0.022
0.021
0.024
Ball Height
C1
0.130
0.100
0.160
0.005
0.004
0.006
Ball Diameter
D
0.250
0.220
0.280
0.010
0.009
0.011
Total Ball Count
N
64
Ball Count X axis
N1
8
Ball Count Y axis
N2
8
UBM
U
0.280
0.270
0.290
0.011
0.011
0.011
Pins Pitch X axis
J1
0.650
0.026
Pins Pitch Y axis
J2
0.650
0.026
BGA ball center to package center offset in
X-direction
X
0.000
-0.025
0.025
0.000
-0.001
0.001
BGA ball center to package center offset in
Y-direction
Y
0.000
-0.025
0.025
0.000
-0.001
0.001
BGA ball center to chip center offset in X-
direction
X1
0.000
-0.014
0.014
0.000
-0.001
0.001
BGA ball center to chip center offset in Y-
direction
Y1
0.000
-0.014
0.014
0.000
-0.001
0.001
Edge to Ball Center Distance along X
S1
0.864
0.834
0.894
0.034
0.033
0.035
Edge to Ball Center Distance along Y
S2
1.049
1.019
1.079
0.041
0.040
0.042



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