L6717ATR datasheet(10/57 Pages) STMICROELECTRONICS

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Pins description and connection diagrams

L6717A

10/57

DocID024465 Rev 1

CORE error amplifier inverting input.

Connect with a resistor R

to VSEN and with an R

- C

to COMP. Droop current for

voltage positioning is sourced from this pin.

VSEN

CORE output voltage monitor.

It manages OVP and UVP protections and PWRGOOD. Connect to the positive side

of the load for remote sensing. See

Section 8 for details.

7FBG

CORE remote ground sense.

Connect to the negative side of the load for remote sensing. See

Section 11 for proper

layout of this connection.

8LTB

LTB Technology

input pin.

Connect through an R

LTB

- C

LTB

network to the regulated voltage (CORE section) to

detect load transient. See

Section 12 for details.

NB_COMP

NB error amplifier output.

Connect with an R

F_NB

- C

F_NB

to NB_FB.

The NB section and/or the device cannot be disabled by grounding this pin.

NB_FB

NB error amplifier inverting input.

Connect with a resistor R

FB_NB

to NB_VSEN and with an R

F_NB

- C

F_NB

to NB_COMP.

Droop current for Voltage Positioning is sourced from this pin.

NB_VSEN

NB output voltage monitor.

It manages OVP and UVP protections and PWRGOOD. Connect to the positive side

of the NB load to perform remote sensing. See

Section 11 for proper layout of this

connection.

NB_FBG

NB remote ground sense.

Connect to the negative side of the load to perform remote sense. See

Section 11 for

proper layout of this connection.

ILIM

CORE overcurrent pin.

A current I

LIM

=DCR/R

OUT

proportional to the current delivered by the CORE

section is sourced from this pin. The OC threshold is programmed by connecting a

resistor R

ILIM

to SGND. When the generated voltage crosses the OC_TOT threshold

OC_TOT

= 2.5V Typ) the device latches with all MOSFETs OFF (to recover, cycle

VCC or the EN pin).

This pin is monitored for dynamic phase management.

Filter with proper capacitor to provide OC masking time (0.5mSec typ time constant).

See

Section 8.4.1 for details.

OSC / EN /

FLT

OSC: It allows programming the switching frequency F

of both Sections. Switching

frequency can be increased according to the resistor R

OSC

connected to SGND with a

gain of 10kHz/μA (see

Section 9 for details). If floating, the switching frequency is

200kHz per phase.

EN: Pull-low to disable the device. When set free, the device immediately checks for

the VID1 status to determine the SVI / PVI protocol to be adopted and configures itself

accordingly.

FLT: The pin is forced high (3.3V) in case of an OV / UV fault. To recover from this

condition, cycle VCC or the EN pin.

Drive with open drain circuit. See

Section 8 for details.

Table 2. Pin description (continued)

Pin#

Name

Function

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