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ST7LITEUS5 数据表(PDF) 122 Page - STMicroelectronics |
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ST7LITEUS5 数据表(HTML) 122 Page - STMicroelectronics |
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122 / 136 page  Obsolete Product(s) - Obsolete Product(s) Obsolete Product(s) - Obsolete Product(s) Package characteristics ST7LITEUS2, ST7LITEUS5 122/136 13.2 Thermal characteristics Table 74. Thermal characteristics Symbol Ratings Value Unit RthJA Package thermal resistance (junction to ambient) Plastic DIP8 82 °C/W SO8 130 DFN8 (on 4-layer PCB) DFN8 (on 2-layer PCB) 50 106 TJmax Maximum junction temperature(1) 1. The maximum chip-junction temperature is based on technology characteristics. 150 °C PDmax Power dissipation(2) 2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is the chip internal power (IDD x VDD) and PPORT is the port power dissipation depending on the ports used in the application. Plastic DIP8 300 mW SO8 180 DFN8 (on 4-layer PCB) 500 DFN8 (on 2-layer PCB) 250 Obsolete Product(s) - Obsolete Product(s) |
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