数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

LSM6DSOP 数据表(PDF) 13 Page - STMicroelectronics

部件名 LSM6DSOP
功能描述  iNEMO inertial module:always-on 3D accelerometer and 3D gyroscope
PDF  107 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

LSM6DSOP 数据表(HTML) 13 Page - STMicroelectronics

Back Button LSM6DSOP Datasheet HTML 9Page - STMicroelectronics LSM6DSOP Datasheet HTML 10Page - STMicroelectronics LSM6DSOP Datasheet HTML 11Page - STMicroelectronics LSM6DSOP Datasheet HTML 12Page - STMicroelectronics LSM6DSOP Datasheet HTML 13Page - STMicroelectronics LSM6DSOP Datasheet HTML 14Page - STMicroelectronics LSM6DSOP Datasheet HTML 15Page - STMicroelectronics LSM6DSOP Datasheet HTML 16Page - STMicroelectronics LSM6DSOP Datasheet HTML 17Page - STMicroelectronics Next Button
Zoom Inzoom in Zoom Outzoom out
 13 / 107 page
background image
DocID032926 Rev 5
13/107
LSM6DSOP
Overview
107
1
Overview
The LSM6DSOP is a system-in-package featuring a high-performance 3-axis digital
accelerometer and 3-axis digital gyroscope, designed for smart pen applications.
The LSM6DSOP delivers best-in-class motion sensing that can detect orientation and
gestures in order to empower application developers and consumers with features and
capabilities that are more sophisticated than simply orienting their devices to portrait and
landscape mode.
The event-detection interrupts enable efficient and reliable motion tracking and contextual
awareness, implementing hardware recognition of 6D orientation, activity or inactivity,
stationary/motion detection and wakeup events.
The LSM6DSOP supports main OS requirements, offering real, virtual and batch mode
sensors.
Up to 9 kbytes of FIFO with compression and dynamic allocation of significant data allows
overall power saving of the system.
Like the entire portfolio of MEMS sensor modules, the LSM6DSOP leverages the robust
and mature in-house manufacturing processes already used for the production of
micromachined accelerometers and gyroscopes. The various sensing elements are
manufactured using specialized micromachining processes, while the IC interfaces are
developed using CMOS technology that allows the design of a dedicated circuit which is
trimmed to better match the characteristics of the sensing element.
The LSM6DSOP is available in a small plastic land grid array (LGA) package of
2.5 x 3.0 x 0.83 mm to address ultra-compact solutions.



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100  ...More


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com