ADP5014ACPZ-R7 datasheet(26/34 Pages) AD

26 / 34 page

ADP5014

Data Sheet

Rev. A | Page 26 of 34

JUNCTION TEMPERATURE

The junction temperature of the die is the sum of the ambient

temperature of the environment and the temperature rise of the

package due to power dissipation, as shown in the following

equation:

TJ = TA + TR

where:

TJ is the junction temperature.

TA is the ambient temperature.

TR is the rise in temperature of the package due to power

dissipation.

The rise in temperature of the package is directly proportional

to the power dissipation in the package. The proportionality

constant for this relationship is the thermal resistance from the

junction of the die to the ambient temperature, as shown in the

following equation:

TR = θJA × PD

where:

TR is the rise in temperature of the package.

θJA is the thermal resistance from the junction of the die to the

ambient temperature of the package (see Table 4). Thermal

performance is directly linked to PCB design and operating

environment. Careful attention to PCB thermal design is

required.

PD is the power dissipation in the package.An important factor

to consider is that the thermal resistance value is based on a

4-layer, 4 inch × 3 inch PCB with 2.5 oz of copper, as specified

in the JEDEC standard, whereas real world applications can use

PCBs with different dimensions and a different number of

layers.

It is important to maximize the amount of copper used to

remove heat from the device. Copper exposed to air dissipates

heat better than copper used in the inner layers. The exposed

pad is connected to the ground plane with several vias.

ADP5014ACPZ-R7 数据表(PDF) 26 Page - Analog Devices

ADP5014ACPZ-R7 数据表(HTML) 26 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34

数据表下载