ADP5014

Data Sheet

Rev. A | Page 34 of 34

OUTLINE DIMENSIONS

0.50

BSC

BOTTOM VIEW

TOP VIEW

SIDE VIEW

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.23

0.18

6.10

6.00 SQ

5.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.45

0.40

0.35

0.20 MIN

4.45

4.30 SQ

4.25

COMPLIANT TO JEDEC STANDARDS MO-220-WJJD-5

40

1

11

20

21

30

31

10

P IN 1

IN D IC AT O R AR E A OP T IO N S

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

EXPOSED

PAD

SEATING

PLANE

PIN 1

INDICATOR

AREA

Figure 48. 40-Lead Lead Frame Chip Scale Package [LFCSP]

6 mm × 6 mm Body, and 0.75 mm Package Height

(CP-40-10)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

ADP5014ACPZ-R7

−40°C to +125°C

40-Lead Lead Frame Chip Scale Package [LFCSP]

CP-40-10

ADP5014-EVALZ

Evaluation Board

1

Z = RoHS Compliant Part.

2

Table 13 lists the factory default options for the device. For a list of factory programmable options, see the Factory Programmable Options section. To order a device

with options other than the default values, contact your local Analog Devices sales or distribution representative.

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registered trademarks are the property of their respective owners.

D15496-0-8/19(A)