STM32H7B3AI datasheet(100/238 Pages) STMICROELECTRONICS

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3. These values are given for PDR ON. When the PDR is OFF (internal reset OFF), the typical current consumption is reduced

(refer to Section 6.3.5 Embedded reset and power control block characteristics).

Table 43. Typical and maximum current consumption in VBAT mode

Symbol

Parameter

Conditions

Typ

Max (3.6V)(1)

Unit

Backup

SRAM

RTC &

LSE(2)

1.2 V 2 V

3 V 3.3 V

TJ =

25 °C

TJ =

85 °C

TJ =

105 °C

TJ=

130 °C

IDD (VBAT)

Supply current in

VBAT mode

OFF

0.01 0.02 0.03 0.07

0.2

1.9

4.6

µA

OFF

0.85 0.93 1.05 1.14

1.5

3.6

7.5

20.0

OFF

0.50 0.63 0.74 0.84

1.2

3.1

5.9

1.34 1.54 1.76 1.91

2.5

4.8

8.8

22.0

1. Guaranteed by characterization results.

2. The LSE clock is in low-drive mode.

I/O system current consumption

I/O static current consumption

All the I/Os used as inputs with pull-up generate a current consumption when the pin is externally held low. The

value of this current consumption can be simply computed by using the pull-up/pull-down resistors values given in

Table 65. I/O static characteristics.

For the output pins, any external pull-down or external load must also be considered to estimate the current

consumption.

An additional I/O current consumption is due to I/Os configured as inputs if an intermediate voltage level is

externally applied. This current consumption is caused by the input Schmitt trigger circuits used to discriminate

the input value. Unless this specific configuration is required by the application, this supply current consumption

can be avoided by configuring these I/Os in analog mode. This is notably the case of ADC input pins which should

be configured as analog inputs.

Caution:

Any floating input pin can also settle to an intermediate voltage level or switch inadvertently, as a result of

external electromagnetic noise. To avoid a current consumption related to floating pins, they must either be

configured in analog mode, or forced internally to a definite digital value. This can be done either by using

pull-up/down resistors or by configuring the pins in output mode.

I/O dynamic current consumption

In addition to the internal peripheral current consumption (see Table 44. Peripheral current consumption in Run

mode), the I/Os used by an application also contribute to the current consumption. When an I/O pin switches,

it uses the current from the MCU supply voltage to supply the I/O pin circuitry and to charge/discharge the

capacitive load (internal or external) connected to the pin:

ISW=VDDx×fsw×CL

where

ISW is the current sunk by a switching I/O to charge/discharge the capacitive load

VDDx is the MCU supply voltage

fSW is the I/O switching frequency

CL is the total capacitance seen by the I/O pin: C = CINT+ CEXT

The test pin is configured in push-pull output mode and is toggled by software at a fixed frequency.

On-chip peripheral current consumption

The MCU is placed under the following conditions:

•

At startup, all I/O pins are in analog input configuration.

•

All peripherals are disabled unless otherwise mentioned.

•

The I/O compensation cell is enabled.

•

frcc_cpu_ck is the CPU clock. fPCLK = frcc_cpu_ck/4, and fHCLK = frcc_cpu_ck/2.

The given value is calculated by measuring the difference of current consumption

STM32H7B3xI

Operating conditions

DS13139 - Rev 8

page 100/238

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