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ENC28J60-C/SP 数据表(PDF) 85 Page - Microchip Technology |
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ENC28J60-C/SP 数据表(HTML) 85 Page - Microchip Technology |
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85 / 96 page ![]() © 2006 Microchip Technology Inc. Preliminary DS39662B-page 83 ENC28J60 17.0 PACKAGING INFORMATION 17.1 Package Marking Information 28-Lead SPDIP XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN Example ENC28J60-I/SP 0610017 28-Lead SOIC XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX YYWWNNN Example ENC28J60-I/SO 0610017 28-Lead QFN XXXXXXXX XXXXXXXX YYWWNNN Example ENC28J60 -I/ML 0610017 28-Lead SSOP XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN Example ENC28J60 -C/SS 0610017 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 3 e 3 e 3 e 3 e |
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