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ENC28J60-C/SP 数据表(PDF) 88 Page - Microchip Technology |
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ENC28J60-C/SP 数据表(HTML) 88 Page - Microchip Technology |
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88 / 96 page ![]() ENC28J60 DS39662B-page 86 Preliminary © 2006 Microchip Technology Inc. 28-Lead Plastic Shrink Small Outline (SS) – 209 mil Body, 5.30 mm (SSOP) E1 p B n D 2 1 E c L A A1 A2 φ 0.38 - 0.22 .015 - .009 B Lead Width 8° 4° 0° 8° 4° 0° φ Foot Angle 0.25 - 0.09 .010 - .004 c Lead Thickness 0.95 0.75 0.55 .037 .030 .022 L Foot Length 10.50 10.20 9.90 .413 .402 .390 D Overall Length 5.60 5.30 5.00 .220 .209 .197 E1 Molded Package Width 8.20 7.80 7.49 .323 .307 .295 E Overall Width - - 0.05 - - .002 A1 Standoff 1.85 1.75 1.65 .073 .069 .065 A2 Molded Package Thickness 2.0 - - .079 - - A Overall Height 0.65 .026 p Pitch 28 28 n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS * INCHES Units Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. Notes: Drawing No. C04-073 Revised 1-12-06 * Controlling Parameter |
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