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ENC28J60-C/SP 数据表(PDF) 87 Page - Microchip Technology

部件名 ENC28J60-C/SP
功能描述  Stand-Alone Ethernet Controller with SPI Interface
PDF  96 Pages
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制造商  MICROCHIP [Microchip Technology]
网页  http://www.microchip.com
标志 MICROCHIP - Microchip Technology

ENC28J60-C/SP 数据表(HTML) 87 Page - Microchip Technology

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© 2006 Microchip Technology Inc.
Preliminary
DS39662B-page 85
ENC28J60
28-Lead Plastic Small Outline (SO) – Wide, 300 mil Body (SOIC)
Foot Angle Top
φ
04
804
8
15
12
0
15
12
0
β
Mold Draft Angle Bottom
15
12
0
15
12
0
α
Mold Draft Angle Top
0.51
0.42
0.36
.020
.017
.014
B
Lead Width
0.33
0.28
0.23
.013
.011
.009
c
Lead Thickness
1.27
0.84
0.41
.050
.033
.016
L
Foot Length
0.74
0.50
0.25
.029
.020
.010
h
Chamfer Distance
18.08
17.87
17.65
.712
.704
.695
D
Overall Length
7.59
7.49
7.32
.299
.295
.288
E1
Molded Package Width
10.67
10.34
10.01
.420
.407
.394
E
Overall Width
0.30
0.20
0.10
.012
.008
.004
A1
Standoff
§
2.39
2.31
2.24
.094
.091
.088
A2
Molded Package Thickness
2.64
2.50
2.36
.104
.099
.093
A
Overall Height
1.27
.050
p
Pitch
28
28
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
2
1
D
p
n
B
E
E1
L
c
β
45
°
h
φ
A2
α
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
§ Significant Characteristic



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