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数据搜索系统，热门电子元器件搜索 |
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数据搜索系统，热门电子元器件搜索 |
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H8S/2225 数据表(PDF) 4 Page - Renesas Technology Corp |
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H8S/2225 数据表(HTML) 4 Page - Renesas Technology Corp |
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4 / 1071 page  Rev. 5.00 Aug 08, 2006 page iv of lxxxvi Configuration of This Manual This manual comprises the following items: 1. General Precautions on Handling of Product 2. Configuration of This Manual 3. Preface 4. Main Revisions in This Edition The list of revisions is a summary of points that have been revised or added to earlier versions. This does not include all of the revised contents. For details, see the actual locations in this manual. 5. Contents 6. Overview 7. Description of Functional Modules • CPU and System-Control Modules • On-Chip Peripheral Modules The configuration of the functional description of each module differs according to the module. However, the generic style includes the following items: i) Feature ii) Input/Output Pin iii) Register Description iv) Operation v) Usage Note When designing an application system that includes this LSI, take notes into account. Each section includes notes in relation to the descriptions given, and usage notes are given, as required, as the final part of each section. 8. List of Registers 9. Electrical Characteristics 10. Appendix 11. Index |
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