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数据搜索系统，热门电子元器件搜索 |
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数据搜索系统，热门电子元器件搜索 |
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H8S/2225 数据表(PDF) 89 Page - Renesas Technology Corp |
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H8S/2225 数据表(HTML) 89 Page - Renesas Technology Corp |
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89 / 1071 page  Section 1 Overview Rev. 5.00 Aug 08, 2006 page 3 of 982 REJ09B0054-0500 • Compact package Package (Code)* 6 Body Size Pin Pitch TQFP-100 TFP-100B, TFP-100BV 14.0 × 14.0 mm 0.5 mm TQFP-100* 1 TFP-100G, TFP-100GV 12.0 × 12.0 mm 0.4 mm QFP-100* 2 FP-100A, FP-100AV 14.0 × 20.0 mm 0.65 mm QFP-100* 3 FP-100B, FP-100BV 14.0 × 14.0 mm 0.5 mm LFBGA-112* 4 BP-112, BP-112V 10.0 × 10.0 mm 0.8 mm TFBGA-112* 5 TBP-112A, TBP-112AV 10.0 × 10.0 mm 0.8 mm Notes: 1. Not supported by the H8S/2258 Group. 2. Supported only by the H8S/2258 Group, H8S/2238B, H8S/2236B, H8S/2237 Group, and HD6432227. 3. Not supported by the HD64F2227. 4. Supported only by the HD64F2238R. 5. Supported only by theHD64F2238R and HD64F2239. 6. Package code ending in the letter V designate Pb-free Product. |
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