H8SSLASH2225 datasheet(77/1071 Pages) RENESAS

77 / 1071 page

Rev. 5.00 Aug 08, 2006 page lxxvii of lxxxvi

Figure 27.4 Power Supply Voltage and Operating Ranges (H8S/2238R and H8S/2236R)....... 842

Figure 27.5 Power Supply Voltage and Operating Ranges (H8S/2237 Group and

H8S/2227 Group) ................................................................................................... 843

Figure 27.6 Output Load Circuit................................................................................................ 853

Figure 27.7 I2C Bus Interface Input/Output Timing (Optional)................................................. 859

Figure 27.8 Output Load Circuit................................................................................................ 873

Figure 27.9 Output Load Circuit................................................................................................ 896

Figure 27.10 System Clock Timing............................................................................................. 948

Figure 27.11 Oscillation Stabilization Timing............................................................................. 948

Figure 27.12 Reset Input Timing................................................................................................. 949

Figure 27.13 Interrupt Input Timing............................................................................................ 949

Figure 27.14 Basic Bus Timing (Two-State Access)................................................................... 950

Figure 27.15 Basic Bus Timing (Three-State Access)................................................................. 951

Figure 27.16 Basic Bus Timing (Three-State Access with One Wait State) ............................... 952

Figure 27.17 Burst ROM Access Timing (Two-State Access).................................................... 953

Figure 27.18 Burst ROM Access Timing (One-State Access) .................................................... 954

Figure 27.19 External Bus Release Timing ................................................................................. 954

Figure 27.20 DMAC Single Address Transfer Timing (Two-State Access) ............................... 955

Figure 27.21 DMAC Single Address Transfer Timing (Three-State Access) ............................. 956

Figure 27.22 DMAC TEND Output Timing................................................................................ 957

Figure 27.23 DMAC DREQ Input Timing .................................................................................. 957

Figure 27.24 I/O Port Input/Output Timing................................................................................. 957

Figure 27.25 TPU Input/Output Timing ...................................................................................... 958

Figure 27.26 TPU Clock Input Timing........................................................................................ 958

Figure 27.27 8-Bit Timer Output Timing .................................................................................... 958

Figure 27.28 8-Bit Timer Clock Input Timing ............................................................................ 959

Figure 27.29 8-Bit Timer Reset Input Timing ............................................................................. 959

Figure 27.30 WDT_1 Output Timing .......................................................................................... 959

Figure 27.31 SCK Clock Input Timing........................................................................................ 959

Figure 27.32 SCI Input/Output Timing (Clocked Synchronous Mode)....................................... 960

Figure 27.33 A/D Converter External Trigger Input Timing....................................................... 960

Figure 27.34 I2C Bus Interface Input/Output Timing (Optional)................................................. 960

Appendix C Package Dimensions

Figure C.1

TFP-100B Package Dimensions............................................................................. 973

Figure C.2

TFP-100G Package Dimensions............................................................................. 974

Figure C.3

FP-100A Package Dimensions ............................................................................... 975

Figure C.4

FP-100B Package Dimensions ............................................................................... 976

Figure C.5

BP-112 Package Dimensions ................................................................................. 977

Figure C.6

TBP-112A, TBP-112AV Package Dimensions...................................................... 978

H8S/2225 数据表(PDF) 77 Page - Renesas Technology Corp

H8S/2225 数据表(HTML) 77 Page - Renesas Technology Corp

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

数据表下载