H8SSLASH2225 datasheet(9/1071 Pages) RENESAS

9 / 1071 page

Rev. 5.00 Aug 08, 2006 page ix of lxxxvi

Main Revisions for This Edition

Item

Page

Revision (See Manual for Details)

All



Description of "under development" for HD64F2239 deleted

1.1 Features

• On-chip memory

Table amended

ROM

Model

ROM

RAM

Remarks

HD6432258

256 kbytes

16 kbytes

Masked ROM

version

HD6432258W

256 kbytes

16 kbytes

HD6432256

128 kbytes

8 kbytes

HD6432256W

128 kbytes

8 kbytes

• Compact package

Package

(Code)*6

TQFP-100

TFP-100B,

TFP-100BV

TQFP-100*

TFP-100G,

TFP-100GV

QFP-100*

FP-100A, FP-100AV

QFP-100*

FP-100B, FP-100BV

LFBGA-112*

BP-112, BP-112V

TFBGA-112*

TBP-112A,

TBP-112AV

Notes amended

Notes: 1. Not supported by the H8S/2258 Group.

2. Supported only by the H8S/2258 Group, H8S/2238B,

H8S/2236B, H8S/2237 Group, and HD6432227.

3. Not supported by the HD64F2227.

4. Supported only by the HD64F2238R.

5. Supported only by the HD64F2238R and HD64F2239.

6. Package code ending in the letter V designate Pb-free

Product.

1.3.1 Pin Arrangement

Figure 1.11 Pin

Arrangement of H8S/2238

Group (FP-100A, FP-100AV:

Top View, Only for

H8S/2238B and H8S/2236B)

Figure 1.11 title amended

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