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910GL 数据表(PDF) 7 Page - Intel Corporation |
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910GL 数据表(HTML) 7 Page - Intel Corporation |
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7 / 426 page ![]() R Datasheet 7 9.1.5 RID2—Revision Identification (D2:F0)................................................ 178 9.1.6 CC—Class Code (D2:F0) ................................................................... 178 9.1.7 CLS—Cache Line Size (D2:F0).......................................................... 179 9.1.8 MLT2—Master Latency Timer (D2:F0)............................................... 179 9.1.9 HDR2—Header Type (D2:F0) ............................................................ 180 9.1.10 MMADR—Memory Mapped Range Address (D2:F0) ........................ 180 9.1.11 IOBAR—I/O Base Address (D2:F0) ................................................... 181 9.1.12 GMADR—Graphics Memory Range Address (D2:F0) ....................... 182 9.1.13 GTTADR—Graphics Translation Table Range Address (D2:F0)....... 183 9.1.14 SVID2—Subsystem Vendor Identification (D2:F0)............................. 183 9.1.15 SID2—Subsystem Identification (D2:F0)............................................ 184 9.1.16 ROMADR—Video BIOS ROM Base Address (D2:F0) ....................... 184 9.1.17 CAPPOINT—Capabilities Pointer (D2:F0) ......................................... 185 9.1.18 INTRLINE—Interrupt Line (D2:F0) ..................................................... 185 9.1.19 INTRPIN—Interrupt Pin (D2:F0) ......................................................... 185 9.1.20 MINGNT—Minimum Grant (D2:F0) .................................................... 186 9.1.21 MAXLAT—Maximum Latency (D2:F0) ............................................... 186 9.1.22 MCAPPTR—Mirror of Dev0 Capability Pointer (D2:F0) (Mirrored_D0_34) ............................................................................... 186 9.1.23 MCAPID—Mirror of Dev0 Capability Identification (D2:F0) (Mirrored_D0_E0) ............................................................................... 186 9.1.24 MGGC—Mirror of Dev0 GMCH Graphics Control (D2:F0) (Mirrored_D0_52) ............................................................................... 187 9.1.25 MDEVENdev0f0—Mirror of Dev0 Device Enable (D2:F0) (Mirrored_D0_54) ............................................................................... 187 9.1.26 BSM—Base of Stolen Memory (D2:F0).............................................. 187 9.1.27 MSAC—Multi Size Aperture Control (D2:F0) ..................................... 188 9.1.28 PMCAPID—Power Management Capabilities ID (D2:F0).................. 188 9.1.29 PMCAP—Power Management Capabilities (D2:F0) .......................... 189 9.1.30 PMCS—Power Management Control/Status (D2:F0) ........................ 190 9.1.31 SWSMI—Software SMI (D2:F0) ......................................................... 191 9.1.32 ASLE—System Display Event Register (D2:F0) ................................ 191 9.1.33 ASLS—ASL Storage (D2:F0) ............................................................. 192 10 Device 2 Function 1 (D2:F1) Configuration Registers (Intel ® 82915G/82915GV/82915GL/ 82910GL Only)................................................................. 193 10.1 Device 2 Function 1 Configuration Register Details (D2:F1) ............................. 194 10.1.1 VID2—Vendor Identification (D2:F1) .................................................. 194 10.1.2 DID2—Device Identification (D2:F1) .................................................. 194 10.1.3 PCICMD2—PCI Command (D2:F1) ................................................... 195 10.1.4 PCISTS2—PCI Status (D2:F1)........................................................... 196 10.1.5 RID2—Revision Identification (D2:F1)................................................ 197 10.1.6 CC—Class Code Register (D2:F1)..................................................... 197 10.1.7 CLS—Cache Line Size (D2:F1).......................................................... 197 10.1.8 MLT2—Master Latency Timer (D2:F1)............................................... 198 10.1.9 HDR2—Header Type Register (D2:F1).............................................. 198 10.1.10 MMADR—Memory Mapped Range Address (D2:F1) ........................ 198 10.1.11 SVID2—Subsystem Vendor Identification (D2:F1)............................. 199 10.1.12 SID2—Subsystem Identification (D2:F1)............................................ 199 10.1.13 ROMADR—Video BIOS ROM Base Address (D2:F1) ....................... 199 10.1.14 CAPPOINT—Capabilities Pointer (D2:F1) ......................................... 199 10.1.15 MINGNT—Minimum Grant Register (D2:F1)...................................... 200 10.1.16 MAXLAT—Maximum Latency (D2:F1) ............................................... 200 |
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