BQ28Z560-R1 datasheet(4/60 Pages) TI1

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Thermal Pad

DOUT

COUT

BAT

VREG

VSS

GPIO

SCL

SDA

SRN

SRP

DRZ Package

(Top View)

bq28z560-R1

SLUSBD3 – APRIL 2013

www.ti.com

PIN DETAILS

Table 1. Pin Descriptions

I/O(1)

DESCRIPTION

NUMBER

NAME

DOUT

The output of the gate drive for discharge FET

COUT

The output of the gate drive for charge FET

Analog input pin connected to the PACKN through a 510-

Ω resistor. Overcurrent and short-circuit

protection circuits use the voltage across VM and VSS to detect if excessive charge or discharge

current is flowing through the protection FETs.

BAT

Cell voltage measurement input. ADC input. Connect a 0.1-µF ceramic capacitor to VSS.

VREG

2.5-V output voltage of the internal integrated LDO. Connect a 0.1-µF ceramic capacitor to VSS.

VSS

Device ground

Analog input pin connected to the internal coulomb counter where SRP is nearest the CELL–

SRP

connection. Connect to a 5-m

Ω to 20-mΩ sense resistor.

Analog input pin connected to the internal coulomb counter where SRN is nearest the PACKN

SRN

connection. Connect to a 5-m

Ω to 20-mΩ sense resistor.

Pack thermistor voltage sense (use 103AT-type thermistor), ADC input

SDA

I/O

Serial Data interface for SMBus

SCL

Serial Clock interface for SMBus

GPIO

I/O

General Purpose control output for configuration as CFET control OR Alert output OR HDQ interface

PWPD

I/O

Thermal Pad. Connect to VSS externally on PCB.

(1)

IA = Input Analog, OA = Output Analog, P = Power Connection

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