STLUX385ATR datasheet(92/99 Pages) STMICROELECTRONICS

92 / 99 page

Thermal characteristics

STLUX385A

92/98

DocID024387 Rev 2

Thermal characteristics

The STLUX385A functionality cannot be guaranteed when the device is operating under the

maximum chip junction temperature (T

Jmax

, in degrees Celsius, may be calculated using the following equation:

Where:

Amax

is the maximum ambient temperature in °C

is the package junction-to-ambient thermal resistance in °C/W

Dmax

is the sum of P

INTmax

and P

I/Omax

Dmax

= P

INTmax

+ PI/O

max

)

INTmax

is the product of I

and V

, expressed in watts. This is the maximum chip internal

power.

I/Omax

represents the maximum power dissipation on output pins where: P

I/Omax

) +

Σ((V

-V

)*I

), taking into account the actual V

and V

of the

I/Os at low and high level.

Table 59. Package thermal characteristics

Symbol

Parameter

Value

Unit

Thermal resistance junction-to-ambient

(1)

Thermal resistance are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection environment.

°C/W

Jm a x

Am a x

max

()

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