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AN2014 数据表(PDF) 59 Page - STMicroelectronics |
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AN2014 数据表(HTML) 59 Page - STMicroelectronics |
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59 / 65 page ![]() DocID10701 Rev 10 59/65 AN2014 Operating conditions 64 7 Operating conditions There are many other operating conditions, imposed by the final application environment, that may also have an adverse affect on the EEPROM device (shortened lifetime or unreliable operation). They should be studied, and solutions must be found to minimize them. 7.1 Temperature The temperature should be kept as low as possible, since high temperatures accelerate wear-out. At high temperatures, cycling endurance and data retention capability are reduced because of charge trapping in the thin oxide of the memory cells. When applications are designed to run in hot environments with high cycling requirements, it is strongly recommended to establish a temperature profile and discuss it with the ST EEPROM quality support (refer to Section 5.5: Cycling endurance and data retention). 7.2 Humidity and chemical vapors Boards should always operate in a clean and dry environment. Humidity and dirt of any kind can cause corrosion and short circuits between package pins and tracks. 7.3 Mechanical stress EEPROM packages cannot withstand excessive weight, local pressure or strong shocks. |
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