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AN2014 数据表(PDF) 6 Page - STMicroelectronics

部件名 AN2014
功能描述  How a designer can make the most of STMicroelectronics serial EEPROMs
PDF  65 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

AN2014 数据表(HTML) 6 Page - STMicroelectronics

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AN2014
List of figures
6
List of figures
Figure 1.
Structure of an EEPROM floating gate transistor, and circuit symbol. . . . . . . . . . . . . . . . . . 7
Figure 2.
MOSFET-like operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 3.
Floating gate reservoir full of electrons (Erased state) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 4.
Floating gate reservoir empty of electrons (Written state) . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 5.
Using the voltage on the Control Gate to determine the charge
on the floating gate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 6.
During erase, electrons go through the tunnel oxide into the floating gate. . . . . . . . . . . . . 10
Figure 7.
During write, electrons go through the tunnel oxide out of the floating gate . . . . . . . . . . . . 10
Figure 8.
VPP signal applied to EEPROM cells
(HiV is the output of the charge pump) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 9.
Accumulation of negative or positive charges in the tunnel oxide . . . . . . . . . . . . . . . . . . . 12
Figure 10.
Architecture of the memory array (showing the grouping in bytes). . . . . . . . . . . . . . . . . . . 13
Figure 11.
Decoding block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 12.
Latchup mechanism and protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 13.
Latchup test conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 14.
Power-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 15.
Local EEPROM supply filtering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 16.
Chip Enable inputs E0, E1, E2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 17.
Serial Data input/output SDA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 18.
SDA bus conflict with push-pull buffers (NOT RECOMMENDED) . . . . . . . . . . . . . . . . . . . 25
Figure 19.
Serial clock input SCL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 20.
Write control input (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 21.
Recommended I²C connections – safe design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 22.
Recommended I²C connections – robust design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 23.
Chip Select, Clock, Data, Hold input pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 24.
Write Protect input W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 25.
Output pin tri-state buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 26.
Recommended SPI connections - safe design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 27.
Recommended SPI connections - robust design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 28.
Chip Select, Clock, Data input pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 29.
Organization input ORG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 30.
Recommended MICROWIRE connections - safe design . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 31.
Recommended MICROWIRE connections - robust design . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 32.
PCB decoupling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 33.
I2C data polling algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 34.
SPI data polling algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Figure 35.
MICROWIRE data polling algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 36.
.Recommended use of the WC pin in I²C products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Figure 37.
Recommended use of the W pin in SPI products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Figure 38.
Example of how to duplicate data safely . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Figure 39.
Write cycling versus temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Figure 40.
I2C bus enters the high impedance state (Master reset) . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Figure 41.
SPI bus enters the high impedance state (Master reset) . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Figure 42.
MICROWIRE bus enters the high impedance state (Master reset) . . . . . . . . . . . . . . . . . . 52
Figure 43.
EEPROM power backup capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Figure 44.
Emergency sequence I2C products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Figure 45.
Emergency sequence SPI products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Figure 46.
Emergency sequence MICROWIRE products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57



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