MPFS250T datasheet(2/128 Pages) MICROCHIP

2 / 128 page

Contents

1 Revision History.................................................................................................................................1

1.1 Revision 1.0.........................................................................................................................................................1

2 Overview............................................................................................................................................2

3 Device Offering..................................................................................................................................3

4 Silicon and Libero Tool Status............................................................................................................4

5 DC Characteristics..............................................................................................................................5

5.1 Absolute Maximum Rating.................................................................................................................................5

5.2 Recommended Operating Conditions.................................................................................................................6

5.2.1 DC Characteristics over Recommended Operating Conditions............................................................8

5.2.2 Maximum Allowed Overshoot and Undershoot..................................................................................9

5.3 Input and Output..............................................................................................................................................14

5.3.1 DC Input and Output Levels...............................................................................................................14

5.3.2 Differential DC Input and Output Levels............................................................................................16

5.3.3 Complementary Differential DC Input and Output Levels.................................................................20

5.3.4 HSIO On-Die Termination...................................................................................................................23

5.3.5 GPIO On-Die Termination..................................................................................................................24

6 AC Switching Characteristics............................................................................................................26

6.1 Microprocessor Subsystem...............................................................................................................................26

6.1.1 CPU Performance...............................................................................................................................26

6.1.2 Clocks.................................................................................................................................................28

6.1.3 MSS DDR............................................................................................................................................28

6.1.4 Gigabit Ethernet MAC........................................................................................................................29

6.1.5 SD_SDIO.............................................................................................................................................30

6.1.6 eMMC................................................................................................................................................32

6.1.7 USB....................................................................................................................................................34

6.1.8 CAN....................................................................................................................................................35

6.1.9 MMUART...........................................................................................................................................35

6.1.10 QSPI.................................................................................................................................................35

6.1.11 SPI....................................................................................................................................................37

6.1.12 I2C....................................................................................................................................................38

6.1.13 Watchdog Timer..............................................................................................................................39

6.1.14 Timers..............................................................................................................................................39

6.1.15 Fabric Interface................................................................................................................................40

6.2 I/O Standards Specifications.............................................................................................................................40

6.2.1 Input Delay Measurement Methodology Maximum PHY Rate for Memory Interface IP..................40

6.2.2 Output Delay Measurement Methodology.......................................................................................45

6.2.3 Input Buffer Speed.............................................................................................................................48

6.2.4 Output Buffer Speed..........................................................................................................................51

6.2.5 Maximum PHY Rate for FPGA Memory Interface IP..........................................................................54

6.2.6 User I/O Switching Characteristics.....................................................................................................55

6.3 Clocking Specifications......................................................................................................................................60

6.3.1 Clocking..............................................................................................................................................60

6.3.2 PLL......................................................................................................................................................62

6.3.3 DLL.....................................................................................................................................................64

6.3.4 RC Oscillators.....................................................................................................................................65

Microsemi Proprietary and Confidential. DS0147 Revision 1.0

Contents

MPFS250T 数据表(PDF) 2 Page - Microchip Technology

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