LPC2917 datasheet(60/68 Pages) PHILIPS

60 / 68 page

LPC2917_19_1

Preliminary data sheet

Rev. 1.01 — 15 November 2007

60 of 68

NXP Semiconductors

LPC2917/19

ARM9 microcontroller with CAN and LIN

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 16.

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

14.3.2 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices

(SMDs) or printed-circuit boards with a high component density, as solder bridging and

non-wetting can present major problems.

Table 32.

SnPb eutectic process (from J-STD-020C)

Package thickness (mm)

Package reflow temperature (

°C)

Volume (mm3)

< 350

≥ 350

< 2.5

235

220

≥ 2.5

220

Table 33.

Lead-free process (from J-STD-020C)

Package thickness (mm)

Package reflow temperature (

°C)

Volume (mm3)

< 350

350 to 2000

> 2000

< 1.6

260

1.6 to 2.5

260

250

245

> 2.5

250

245

MSL: Moisture Sensitivity Level

Fig 16. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

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