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LPC2917 数据表(PDF) 11 Page - NXP Semiconductors |
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LPC2917 数据表(HTML) 11 Page - NXP Semiconductors |
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11 / 68 page ![]() LPC2917_19_1 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 1.01 — 15 November 2007 11 of 68 NXP Semiconductors LPC2917/19 ARM9 microcontroller with CAN and LIN 7.1.3 IEEE 1149.1 interface pins (JTAG boundary-scan test) The LPC2917/19 contains boundary-scan test logic according to IEEE 1149.1, also referred to in this document as Joint Test Action Group (JTAG). The boundary-scan test pins can be used to connect a debugger probe for the embedded ARM processor. Pin JTAGSEL selects between boundary-scan mode and debug mode. Table 5 shows the boundary- scan test pins. 7.1.4 Power supply pins description Table 6 shows the power supply pins. 7.2 Clocking strategy 7.2.1 Clock architecture The LPC2917/19 contains several different internal clock areas. Peripherals like Timers, SPI, UART, CAN and LIN have their own individual clock sources called Base Clocks. All base clocks are generated by the Clock Generator Unit (CGU). They may be unrelated in frequency and phase and can have different clock sources within the CGU. The system clock for the CPU and AHB Multilayer Bus infrastructure has its own base clock. This means most peripherals are clocked independently from the system clock. See Figure 3 for an overview of the clock areas within the device. Within each clock area there may be multiple branch clocks, which offers very flexible control for power-management purposes. All branch clocks are outputs of the Power Management Unit (PMU) and can be controlled independently. Branch clocks derived from the same base clock are synchronous in frequency and phase. See Section 8.8 for more details of clock and power control within the device. Table 5. IEEE 1149.1 boundary-scan test and debug interface Symbol Description JTAGSEL TAP controller select input. LOW level selects ARM debug mode and HIGH level selects boundary scan and flash programming; pulled up internally TRSTN test reset input; pulled up internally (active LOW) TMS test-mode select input; pulled up internally TDI test data input, pulled up internally TDO test data output TCK test clock input Table 6. Power supplies Symbol Description VDD(CORE) digital core supply 1.8 V VSS(CORE) digital core ground (digital core, ADC 1) VDD(IO) I/O pins supply 3.3 V VSS(IO) I/O pins ground VDD(OSC) oscillator and PLL supply VSS(OSC) oscillator ground VDD(A3V3) ADC 3.3 V supply VSS(PLL) PLL ground |
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