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ADSP-BF504 数据表(PDF) 79 Page - Analog Devices

部件名 ADSP-BF504
功能描述  Blackfin Embedded Processor
PDF  80 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADSP-BF504 数据表(HTML) 79 Page - Analog Devices

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Preliminary Technical Data
Rev. PrC
|
Page 79 of 80
|
January 2010
ADSP-BF504/F,ADSP-BF506F
SURFACE MOUNT DESIGN
Table 56 is provided as an aide to PCB design. For industry-
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
ORDERING GUIDE
Figure 100. 88-Lead LFCSP (BC-CP-1)
COMPLIANT TO JEDEC STANDARDS MO-220-VRRD.
1
22
66
45
23
44
88
67
0.50
0.40
0.30
0.30
0.23
0.18
10.50
REF
0.60 MAX
0.60
MAX
6.70
REF SQ
0.50
BSC
0.138~0.194 REF
12° MAX
SEATING
PLANE
TOP VIEW
EXPOSED PAD
BOTTOM VIEW
0.85
0.80
0.75
0.70
0.65
0.60
0.045
0.025
0.005
PIN 1
INDICATOR
12.10
12.00 SQ
11.90
11.85
11.75 SQ
11.65
PIN 1
INDICATOR
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Table 56. Surface Mount Design Supplement
Package
Ball Attach Type
Solder Mask Opening
Lead Pad Size
120-Lead LQFP
Solder Mask Defined
TBD mm diameter
TBD mm diameter
88-Lead LFCSP
Solder Mask Defined
TBD mm diameter
TBD mm diameter
Table 57. ADSP-BF50x Processors1
1 For feature comparison between ADSP-BF504, ADSP-BF504F, and ADSP-BF506F processors, see the Processor Comparison in Table 1 on Page 3.
Model
Temperature
Range
2
2 Referenced temperature is ambient temperature.
Processor Instruction
Rate (Max)
Package Description
Package
Option
ADSPBF504BCPZ-ENG
–40ºC to +85ºC
400 MHz
88-Lead LFCSP
BC-CP-1
ADSPBF504FBCPZ-ENG
–40ºC to +85ºC
400 MHz
88-Lead LFCSP
BC-CP-1
ADSPBF506FBSWZ-ENG
–40ºC to +85ºC
400 MHz
120-Lead LQFP
SQ-120-2



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