SPEAR320S datasheet(67/113 Pages) STMICROELECTRONICS

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SPEAr320S

Electrical characteristics

Doc ID 022508 Rev 2

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Electrical characteristics

4.1

Absolute maximum ratings

This product contains devices to protect the inputs against damage due to high/low static

voltages. However, it is advisable to take normal precaution to avoid application of any

voltage higher/lower than the specified maximum/minimum rated voltages.

Caution:

Stresses above those listed in Table 33 may cause permanent damage to the device.

Exposure to maximum rating conditions for extended periods may affect device reliability.

4.2

Maximum power consumption

Note:

These values take into consideration the worst cases of process variation and voltage range

and must be used to design the power supply section of the board.

Table 33.

Absolute maximum ratings

Symbol

Parameter

Min

Max

Unit

VDD 1.2

Supply voltage for the core

- 0.3

1.44

VDD 3.3

Supply voltage for the I/Os

- 0.3

3.9

VDD 2.5

Supply voltage for the analog blocks

- 0.3

VDD 1.8

Supply voltage for the DRAM interface

- 0.3

2.16

VDD RTC

RTC supply voltage

-0.3

2.16

TSTG

Storage temperature

-55

150

°C

Table 34.

Maximum power consumption

Symbol

Description

Max

Unit

IDD(1.2Vsupply)

Current consumption of VDD 1.2 supply voltage for the core

400

IDD(1.8Vsupply)

Current consumption of VDD 1.8 supply voltage for the

DRAM interface (1)

Peak current with Linux memory test (50% write and 50% read) plus DMA reading memory.

150

IDD(RTC)

Current consumption of RTC supply voltage

µA

IDD(2.5Vsupply)

Current consumption of 2.5V supply voltage for the analog

blocks

IDD(3.3Vsupply)

Current consumption of 3.3V supply voltage for the I/Os(2)

With 30 logic channels connected to the device and simultaneously switching at 10 MHz.

Maximum power consumption(3)

Based on bench measurements for worst case silicon under worst case operating conditions. Devices

tested with operating system running, CPU and DDR2 running at 333 MHz, DDR2 driven by PLL2,

SDRAM and all on-chip peripherals and internal modules enabled.

1.2 V current and power are primarily dependent on the applications running and the use of internal chip

functions (DMA, USB, Ethernet, and so on).

3.3 V current and power are primarily dependent on the capacitive loading, frequency, and utilization of the

external buses.

870

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