LSM6DS3 datasheet(15/100 Pages) STMICROELECTRONICS

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LSM6DS3

Overview

100

Overview

The LSM6DS3 is a system-in-package featuring a high-performance 3-axis digital

accelerometer and 3-axis digital gyroscope.

The integrated power-efficient modes are able to reduce the power consumption down to

1.25 mA in high-performance mode, combining always-on low-power features with superior

sensing precision for an optimal motion experience for the consumer thanks to ultra-low

noise performance for both the gyroscope and accelerometer.

The LSM6DS3 delivers best-in-class motion sensing that can detect orientation and

gestures in order to empower application developers and consumers with features and

capabilities that are more sophisticated than simply orienting their devices to portrait and

landscape mode.

The event-detection interrupts enable efficient and reliable motion tracking and contextual

awareness, implementing hardware recognition of free-fall events, 6D orientation, tap and

double-tap sensing, activity or inactivity, and wakeup events.

The LSM6DS3 supports main OS requirements, offering real, virtual and batch mode

sensors. In addition, the LSM6DS3 can efficiently run the sensor-related features specified

in Android, saving power and enabling faster reaction time. In particular, the LSM6DS3 has

been designed to implement hardware features such as significant motion, tilt, pedometer

functions, timestamping and to support the data acquisition of an external magnetometer

with ironing correction (hard, soft).

The LSM6DS3 offers hardware flexibility to connect the pins with different mode

connections to external sensors to expand functionalities such as adding a sensor hub, etc.

Up to 8 kbyte of FIFO with dynamic allocation of significant data (i.e. external sensors,

timestamp, etc.) allows overall power saving of the system.

Like the entire portfolio of MEMS sensor modules, the LSM6DS3 leverages on the robust

and mature in-house manufacturing processes already used for the production of

micromachined accelerometers and gyroscopes. The various sensing elements are

manufactured using specialized micromachining processes, while the IC interfaces are

developed using CMOS technology that allows the design of a dedicated circuit which is

trimmed to better match the characteristics of the sensing element.

The LSM6DS3 is available in a small plastic land grid array (LGA) package of

2.5 x 3.0 x 0.83 mm to address ultra-compact solutions.

LSM6DS3 数据表(PDF) 15 Page - STMicroelectronics

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