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LSM6DS3 数据表(PDF) 40 Page - STMicroelectronics |
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LSM6DS3 数据表(HTML) 40 Page - STMicroelectronics |
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40 / 100 page  Application hints LSM6DS3 40/100 DocID026899 Rev 8 7 Application hints 7.1 LSM6DS3 electrical connections in Mode 1 Figure 14. LSM6DS3 electrical connections in Mode 1 1. Leave pin electrically unconnected and soldered to PCB. The device core is supplied through the Vdd line. Power supply decoupling capacitors (C1, C2 = 100 nF ceramic) should be placed as near as possible to the supply pin of the device (common design practice). The functionality of the device and the measured acceleration/angular rate data is selectable and accessible through the SPI/I2C interface. The functions, the threshold and the timing of the two interrupt pins for each sensor can be completely programmed by the user through the SPI/I2C interface. |
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