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EDB8164B4PR-1DITF-R 数据表(PDF) 51 Page - Micron Technology

部件名 EDB8164B4PR-1DITF-R
功能描述  216-Ball and 220-Ball, Dual-Channel LPDDR2 SDRAM Features
PDF  152 Pages
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制造商  MICRON [Micron Technology]
网页  http://www.micron.com
标志 MICRON - Micron Technology

EDB8164B4PR-1DITF-R 数据表(HTML) 51 Page - Micron Technology

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Figure 24: Burst READ Followed by Burst WRITE – RL = 3, WL = 1, BL = 4
Bank n
col addr
Col addr
READ
NOP
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK#
CK
CA[9:0]
CMD
DQS#
DQS
DQ
RL = 3
WL = 1
BL/2
Transitioning data
NOP
NOP
NOP
NOP
tDQSCK
tDQSSmin
WRITE
D
IN A0
D
IN A1
D
D
OUT A0
D
OUT A1
D
OUT A2
D
OUT A3
NOP
NOP
Bank n
col addr
Col addr
The minimum time from the burst READ command to the burst WRITE command is
defined by the read latency (RL) and the burst length (BL). Minimum READ-to-WRITE
latency is RL + RU(tDQSCK(MAX)/tCK) + BL/2 + 1 - WL clock cycles. Note that if a READ
burst is truncated with a burst TERMINATE (BST) command, the effective burst length
of the truncated READ burst should be used for BL when calculating the minimum
READ-to-WRITE delay.
Figure 25: Seamless Burst READ – RL = 3, BL = 4, tCCD = 2
Bankn
col addr a
Col addr a
READ
NOP
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK#
CK
CA[9:0]
CMD
DQS#
DQS
DQ
RL = 3
Transitioning data
READ
NOP
NOP
NOP
tCCD = 2
NOP
D
OUT B0
D
OUT B1
D
OUT B2
D
OUT B3
D
OUT A0
D
OUT A1
D
OUT A2
D
OUT A3
NOP
NOP
Bankn
col addr b
Col addr b
A seamless burst READ operation is supported by enabling a READ command at every
other clock cycle for BL = 4 operation, every fourth clock cycle for BL = 8 operation, and
every eighth clock cycle for BL = 16 operation. This operation is supported as long as the
banks are activated, whether the accesses read the same or different banks.
216-Ball and 220-Ball, Dual-Channel LPDDR2 SDRAM
Burst READ Command
09005aef85eb530a
216b_220b_2ch_2e0e_embedded_lpddr2.pdf – Rev. F 08 /16 EN
51
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.



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