EDB8164B4PR-1DITF-R datasheet(73/152 Pages) MICRON

73 / 152 page

Figure 46: All-Bank REFRESH Operation

PRECHARGE

NOP

Tx + 1

Ty + 1

CK_c

CK_t

CA[9:0]

CMD

NOP

REFab

NOP

REFab

≥tRPab

≥tRFCab

NOP

Valid

NOP

Figure 47: Per-Bank REFRESH Operation

PRECHARGE

REFRESH to bank 0

NOP

Tx + 1

Tx + 2

Ty + 1

Tz + 1

CK_c

CK_t

CA[9:0]

CMD

NOP

REFpb

NOP

REFpb

≥tRPab

≥tRFCpb

NOP

ACTIVATE

NOP

Bank 1

Row A

REFRESH to bank 1

ACTIVATE command

to bank 1

Notes:

1. Prior to T0, the REFpb bank counter points to bank 0.

2. Operations to banks other than the bank being refreshed are supported during the

tRFCpb period.

SELF REFRESH Operation

The SELF REFRESH command can be used to retain data in the array, even if the rest of

the system is powered down. When in the self refresh mode, the device retains data

without external clocking. The device has a built-in timer to accommodate the SELF

REFRESH operation.

The SELF REFRESH command is executed by taking CKE LOW, CS_n LOW, CA0 LOW,

CA1 LOW, and CA2 HIGH at the rising edge of the clock. CKE must be HIGH during the

previous clock cycle. A NOP command must be driven in the clock cycle following the

POWER-DOWN command. Once the command is registered, CKE must be held LOW to

keep the device in self-refresh mode.

The mobile LPDDR2 device can operate in self refresh mode in both the standard and

extended temperature ranges. The device also manages self refresh power consumption

when the operating temperature changes, resulting in the lowest possible power con-

sumption across the operating temperature range (See IDD Specifications for details).

After the device has entered self refresh mode, all external signals other than CKE are

“Don’t Care.” For proper self refresh operation, power supply pins (VDD1, VDD2, and

VDDQ) must be at valid levels. VDDQ can be turned off during self refresh. If VDDQ is

turned off, VREFDQ must also be turned off. Prior to exiting self refresh, both VDDQ and

216-Ball and 220-Ball, Dual-Channel LPDDR2 SDRAM

SELF REFRESH Operation

09005aef85eb530a

216b_220b_2ch_2e0e_embedded_lpddr2.pdf – Rev. F 08 /16 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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