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26HS01GTAM03 数据表(PDF) 4 Page - Infineon Technologies AG |
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26HS01GTAM03 数据表(HTML) 4 Page - Infineon Technologies AG |
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4 / 166 page ![]() Datasheet 4 of 166 002-12337 Rev. *Y 2022-01-18 256Mb/512Mb/1Gb SEMPER™ Flash HYPERBUS™ interface, 1.8V/3.0V Table of contents Table of contents Features ...........................................................................................................................................1 Performance summary ......................................................................................................................2 Data integrity....................................................................................................................................3 Table of contents...............................................................................................................................4 1 Pinout and signal description...........................................................................................................6 2 Interface overview..........................................................................................................................8 2.1 General description ................................................................................................................................................8 2.2 HYPERBUS™ transaction protocol .......................................................................................................................10 2.3 Legacy (x1) SPI transaction protocol ...................................................................................................................13 2.4 Embedded operations ..........................................................................................................................................16 2.5 Register naming convention ................................................................................................................................17 2.6 HYPERBUS™ transaction naming convention .....................................................................................................17 2.7 Legacy (x1) SPI transaction naming convention.................................................................................................18 3 Address space maps ......................................................................................................................19 3.1 SEMPER™ Flash memory array.............................................................................................................................19 3.2 Address space overlays (ASO) (HYPERBUS™ only) ..............................................................................................21 3.3 ID address space ...................................................................................................................................................23 3.4 SFDP JEDEC JESD216 serial flash discoverable parameters (SFDP) space .......................................................23 3.5 Secure SSR address space....................................................................................................................................23 3.6 Registers (Legacy (x1) SPI only)............................................................................................................................24 4 Features.......................................................................................................................................26 4.1 Error detection and correction.............................................................................................................................26 4.2 Infineon® Endurance Flex architecture (wear leveling) ......................................................................................31 4.3 Interface CRC.........................................................................................................................................................34 4.4 Data integrity CRC.................................................................................................................................................36 4.5 Data protection schemes .....................................................................................................................................37 4.6 SafeBoot................................................................................................................................................................47 4.7 AutoBoot ...............................................................................................................................................................52 4.8 Read transactions .................................................................................................................................................53 4.9 Write transactions - Legacy (x1) SPI.....................................................................................................................63 4.10 Program...............................................................................................................................................................65 4.11 Erase ....................................................................................................................................................................72 4.12 Suspend and resume embedded operation......................................................................................................76 4.13 Error types and reporting - HYPERBUS™ ...........................................................................................................80 4.14 Error typer and reporting - Legacy (x1) SPI........................................................................................................81 4.15 Reset ....................................................................................................................................................................82 4.16 Power modes ......................................................................................................................................................86 4.17 Power up and power down ................................................................................................................................87 5 Registers......................................................................................................................................89 5.1 Register naming convention ................................................................................................................................90 5.2 HYPERBUS™ registers ...........................................................................................................................................90 5.3 Legacy (x1) SPI registers .....................................................................................................................................106 6 Transaction table........................................................................................................................ 124 6.1 HYPERBUS™ transaction table ...........................................................................................................................124 6.2 Legacy (x1) SPI transaction table.......................................................................................................................137 7 Electrical characteristics ............................................................................................................. 140 7.1 Absolute maximum ratings ................................................................................................................................140 7.2 Operating range ..................................................................................................................................................140 7.3 Thermal resistance.............................................................................................................................................140 7.4 Capacitance characteristics ...............................................................................................................................141 7.5 Latchup characteristics ......................................................................................................................................141 |
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