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26HS01GTAM03 数据表(PDF) 4 Page - Infineon Technologies AG

部件名 26HS01GTAM03
功能描述  256Mb/512Mb/1Gb SEMPER??Flash HYPERBUS??interface, 1.8V/3.0V
PDF  166 Pages
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制造商  INFINEON [Infineon Technologies AG]
网页  http://www.infineon.com
标志 INFINEON - Infineon Technologies AG

26HS01GTAM03 数据表(HTML) 4 Page - Infineon Technologies AG

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Datasheet
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002-12337 Rev. *Y
2022-01-18
256Mb/512Mb/1Gb SEMPER™ Flash
HYPERBUS™ interface, 1.8V/3.0V
Table of contents
Table of contents
Features ...........................................................................................................................................1
Performance summary ......................................................................................................................2
Data integrity....................................................................................................................................3
Table of contents...............................................................................................................................4
1 Pinout and signal description...........................................................................................................6
2 Interface overview..........................................................................................................................8
2.1 General description ................................................................................................................................................8
2.2 HYPERBUS™ transaction protocol .......................................................................................................................10
2.3 Legacy (x1) SPI transaction protocol ...................................................................................................................13
2.4 Embedded operations ..........................................................................................................................................16
2.5 Register naming convention ................................................................................................................................17
2.6 HYPERBUS™ transaction naming convention .....................................................................................................17
2.7 Legacy (x1) SPI transaction naming convention.................................................................................................18
3 Address space maps ......................................................................................................................19
3.1 SEMPER™ Flash memory array.............................................................................................................................19
3.2 Address space overlays (ASO) (HYPERBUS™ only) ..............................................................................................21
3.3 ID address space ...................................................................................................................................................23
3.4 SFDP JEDEC JESD216 serial flash discoverable parameters (SFDP) space .......................................................23
3.5 Secure SSR address space....................................................................................................................................23
3.6 Registers (Legacy (x1) SPI only)............................................................................................................................24
4 Features.......................................................................................................................................26
4.1 Error detection and correction.............................................................................................................................26
4.2 Infineon® Endurance Flex architecture (wear leveling) ......................................................................................31
4.3 Interface CRC.........................................................................................................................................................34
4.4 Data integrity CRC.................................................................................................................................................36
4.5 Data protection schemes .....................................................................................................................................37
4.6 SafeBoot................................................................................................................................................................47
4.7 AutoBoot ...............................................................................................................................................................52
4.8 Read transactions .................................................................................................................................................53
4.9 Write transactions - Legacy (x1) SPI.....................................................................................................................63
4.10 Program...............................................................................................................................................................65
4.11 Erase ....................................................................................................................................................................72
4.12 Suspend and resume embedded operation......................................................................................................76
4.13 Error types and reporting - HYPERBUS™ ...........................................................................................................80
4.14 Error typer and reporting - Legacy (x1) SPI........................................................................................................81
4.15 Reset ....................................................................................................................................................................82
4.16 Power modes ......................................................................................................................................................86
4.17 Power up and power down ................................................................................................................................87
5 Registers......................................................................................................................................89
5.1 Register naming convention ................................................................................................................................90
5.2 HYPERBUS™ registers ...........................................................................................................................................90
5.3 Legacy (x1) SPI registers .....................................................................................................................................106
6 Transaction table........................................................................................................................ 124
6.1 HYPERBUS™ transaction table ...........................................................................................................................124
6.2 Legacy (x1) SPI transaction table.......................................................................................................................137
7 Electrical characteristics ............................................................................................................. 140
7.1 Absolute maximum ratings ................................................................................................................................140
7.2 Operating range ..................................................................................................................................................140
7.3 Thermal resistance.............................................................................................................................................140
7.4 Capacitance characteristics ...............................................................................................................................141
7.5 Latchup characteristics ......................................................................................................................................141



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