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26HS01GTAM03 数据表(PDF) 6 Page - Infineon Technologies AG |
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26HS01GTAM03 数据表(HTML) 6 Page - Infineon Technologies AG |
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6 / 166 page ![]() Datasheet 6 of 166 002-12337 Rev. *Y 2022-01-18 256Mb/512Mb/1Gb SEMPER™ Flash HYPERBUS™ interface, 1.8V/3.0V Pinout and signal description 1 Pinout and signal description Figure 1 24-ball BGA pinout configuration[1] RSTO# DNU RESET# INT# CK# CK VSS VCC DNU VSSQ CS# DS DQ2 DNU VCCQ DQ1 DQ0 DQ3 DQ4 DQ7 DQ6 DQ5 VCCQ VSSQ B A C D E 1 2 345 Top View Note 1. Flash memory devices in BGA packages can be damaged if exposed to ultrasonic cleaning methods. The package, data integrity, or both may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time. |
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