ADP5140WACCZ-R7 datasheet(18/128 Pages) AD

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ADP5140

Data Sheet

Rev. 0 | Page 18 of 128

ABSOLUTE MAXIMUM RATINGS

Table 11.

Parameter

Rating

AVIN, AVDD, VIO, EN, and SEQ

−0.3 V to +6 V

WAKE

−0.3 V to +6 V

SYNC

−0.3 V to VVIO

PVIN1, PVIN2, PVIN3, and PVIN4

−0.3 V to +6 V

SW1, SW2, SW3, and SW4

−1 V to +6 V

FB1, FB2, FB3, and FB4

−0.3 V to +6 V

VSET1

−0.3 V to +6 V

PVIN56, OUT5, OUT6, FB5, and FB6

−0.3 V to +6 V

PVIN78, OUT7, FB7, OUT8, FB8, PVIN9,

OUT9, FB9, REFCAP, and VREG

−0.3 V to +2.16 V

SW1, SW2, OUT12, and FB12

−0.3 V to +6 V

PVIN1011, OUT10, OUT11, FB10, and FB11

−0.3 V to +6 V

VM0 and VM1

−0.3 V to +6 V

MODE

−0.3 V to +6 V

RESET, STATUS, and FAULT

−0.3 V to +6 V

WDI0 and WDI1

−0.3 V to VVIO

CS, SCK, MOSI, and MISO

−0.3 V to VVIO

PGND

−0.3 V to +0.3 V

Operating Junction Temperature Range

−40°C to +150°C

Storage Temperature Range

−50°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any

other conditions above those indicated in the operational section

of this specification is not implied. Operation beyond the

maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Close attention to

PCB thermal design is required.

θJA is the junction to ambient thermal resistance of the device,

and θJC is the junction to case thermal resistance of the device.

Both θJA and θJC are specified for the worst-case conditions, that is,

a device soldered in a circuit board for surface-mount packages.

Table 12. Thermal Resistance

Package Type

θJA

θJC

Unit

56-Terminal LGA

17.4

12.5

°C/W

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of

ESD-sensitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Charged device model (CDM) per ANSI/ESDA/JEDEC JS-002.

ESD Ratings for ADP5140

Table 13. ADP5140, 56-Terminal LGA

ESD Model

Withstand Threshold (V)

Class Level

HBM

2000

AEC Q100-002, H1C

CDM

750 (corner pins)

AEC Q100-011, C4B

500 (all other pins)

ESD CAUTION

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