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SPC58EG80C3 数据表(PDF) 36 Page - STMicroelectronics

部件名 SPC58EG80C3
功能描述  32-bit Power Architecture microcontroller for automotive ASIL-D applications
PDF  139 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

SPC58EG80C3 数据表(HTML) 36 Page - STMicroelectronics

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Electrical characteristics
SPC584Gx, SPC58EGx, SPC58NGx
36/139
DS11758 Rev 6
4.8.3
I/O pad current specifications
The I/O pads are distributed across the I/O supply segment. Each I/O supply segment is
associated to a VDD/VSS supply pair as described in the device pinout Microsoft Excel file
attached to the IO_Definition document.
Table 17 provides I/O consumption figures.
In order to ensure device reliability, the average current of the I/O on a single segment
should remain below the IRMSSEG maximum value.
In order to ensure device functionality, the sum of the dynamic and static current of the I/O
on a single segment should remain below the IDYNSEG maximum value.
Pad mapping on each segment can be optimized using the pad usage information provided
on the I/O Signal Description table.
Table 17. I/O consumption
Symbol
C
Parameter
Conditions
Value(1)
Unit
Min
Typ
Max
Average consumption(2)
IRMSSEG
SR
D
Sum of all the DC I/O current
within a supply segment
——
80
mA
IRMS_W
CC
D
RMS I/O current for WEAK
configuration
CL = 25 pF, 2 MHz,
VDD =5.0 V ± 10 %
——
1.1
mA
CL = 50 pF, 1 MHz,
VDD =5.0 V ± 10 %
——
1.1
CL = 25 pF, 2 MHz,
VDD =3.3 V ± 10 %
——
1.0
CL = 25 pF, 1 MHz,
VDD = 3.3 V ± 10%
——
1.0
IRMS_M
CC
D
RMS I/O current for MEDIUM
configuration
CL =25pF, 12MHz,
VDD = 5.0 V ± 10%
——
5.5
mA
CL = 50 pF, 6 MHz,
VDD = 5.0 V ± 10%
——
5.5
CL =25pF, 12MHz,
VDD = 3.3 V ± 10%
——
4.2
CL = 25 pF, 6 MHz,
VDD = 3.3 V ± 10%
——
4.2
IRMS_S
CC
D
RMS I/O current for STRONG
configuration
CL =25pF, 50MHz,
VDD = 5.0 V ± 10%
——
21
mA
CL =50pF, 25MHz,
VDD = 5.0 V ± 10%
——
21
CL =25pF, 25MHz,
VDD = 3.3 V ± 10%
——
10
CL =25pF, 12.5 MHz,
VDD = 3.3 V ± 10%
——
10



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