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C5C5EDELTA-RM/D 数据表(PDF) 103 Page - NXP Semiconductors |
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C5C5EDELTA-RM/D 数据表(HTML) 103 Page - NXP Semiconductors |
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103 / 114 page ![]() 03 C3ENPA1-DS/D Rev 03 Chapter 4 MECHANICAL SPECIFICATIONS Package Views The C-3e network processor is an 728 pin (27 pins x 27 pins) Ball Grid Array (BGA) package as shown in the following illustrations. Table 57 defines the package measurements. Figure 28 C-3e Network Processor BGA Package Side View HiTCE: Green ceramic is thermally matched to FR4 circuit board. A Seating Plane A 1 A 2 A 3 A 4 Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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