C5C5EDELTA-RMSLASHD datasheet(106/114 Pages) NXP

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106

CHAPTER 4: MECHANICAL SPECIFICATIONS

C3EN

Package Measurements

Table 57 defines the C-3e NP package measurements, providing nominal, minimum, and

maximum sizes where appropriate.

At Motorola’s discretion up to fourteen (14) capacitors may or may not be attached on

the top of the package.

Marking Codes

Table 58 explains the marking on the C-3e NP.

Table 57 Package Measurements (Reference Figure 28, Figure 29 and Figure 30 for Symbols)

SYMBOL

DEFINITION

NOM. (MM)

MIN. (MM)

MAX. (MM)

Overall

3.11

2.83

3.39

Ball height

0.70

0.6

0.8

C4 and Die

0.86

Body thickness

1.55

1.41

1.69

Capacitor pad

0.6

Body size

29.00

28.80

29.20

Ball footprint (X)

26.00

Body size

29.00

28.80

29.20

Ball footprint (Y)

26.00

Ball pitch

1.00

Ball diameter

0.70

Table 58 C-3e Network Processor Marking Codes

MARKING (EXPLANATION OF CODES)

Top

Logo/Part#/Date Code

Bottom

N/A

Pin 1 Marking

Chamfered Corner

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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