GD32F310 datasheet(6/81 Pages) GIGADEVICE

6 / 81 page

GD32F310xx Datasheet

List of Tables

Table 2-1. GD32F310xx devices features and peripheral list

.........................................................................8

Table 2-2. GD32F310xx devices features and peripheral list (continued)

..................................................9

Table 2-3. GD32F310xx memory map

.................................................................................................................14

Table 2-4. GD32F310Cx LQFP48 pin definitions..............................................................................................17

Table 2-

5. GD32F310Kx LQFP32 pin definitions..............................................................................................20

Table 2-6. GD32F310KxU6 QFN32 pin definitions ...........................................................................................22

Table 2-7. GD32F310Gx QFN28 pin definitions................................................................................................24

Table 2-8. GD32F310FxP6 TSSOP20 pin definitions.......................................................................................26

Table 2-9. Port A alternate functions summary

...............................................................................................28

Table 2-10. Port B alternate functions summary

.............................................................................................29

Table 2-11. Port C alternate functions summary

.............................................................................................30

Table 2-12. Port D alternate functions summary

.............................................................................................30

Table 2-13. Port F alternate functions summary

.............................................................................................31

Table 4-1. Absolute maximum ratings(1)(4) .........................................................................................................39

Table 4-2. DC operating conditions.....................................................................................................................39

Table 4-3. Clock frequency(1).................................................................................................................................40

Table 4-4. Operating conditions at Power up/ Power down(1) ......................................................................40

Table 4-5. Start-up timings of Operating conditions(1)(2)(3).............................................................................40

Table 4-6. Power saving mode wakeup timings characteristics(1)(2) ...........................................................41

Table 4-7.Power consumption characteristics(2)(3)(3)(4)(5)(6)..............................................................................41

Table 4-8. Peripheral current consumption characteristics(1) ......................................................................45

Table 4-9. EMS characteristics(1)

.........................................................................................................................46

Table 4-10. EMI characteristics(1)

.........................................................................................................................47

Table 4-11. Power supply supervisor characteristics

....................................................................................48

Table 4-12. ESD characteristics(1)

........................................................................................................................49

Table 4-13. Static latch-up characteristics(1)

.....................................................................................................49

Table 4-14. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics ..49

Table 4-15. High speed external user clock characteristics (HXTAL in bypass mode).........................49

Table 4-16. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics ...50

Table 4-17. Low speed external user clock characteristics (LXTAL in bypass mode) ..........................50

Table 4-18. High speed internal clock (IRC8M) characteristics ...................................................................51

Table 4-19. Low speed internal clock (IRC40K) characteristics ..................................................................51

Table 4-20. High speed internal clock (IRC28M) characteristics .................................................................52

Table 4-21. High speed internal clock (IRC48M) characteristics .................................................................52

Table 4-22. PLL characteristics............................................................................................................................53

Table 4-23 Flash memory characteristics(1) ......................................................................................................53

Table 4-24. NRST pin characteristics .................................................................................................................54

Table 4-25. I/O port DC characteristics(1)(3) ........................................................................................................54

Table 4-26. I/O port AC characteristics(1)(2) ........................................................................................................55

Table 4-27. ADC characteristics

..........................................................................................................................56

GD32F310 数据表(PDF) 6 Page - GigaDevice Semiconductor (Beijing) Inc.

GD32F310 数据表(HTML) 6 Page - GigaDevice Semiconductor (Beijing) Inc.

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81

数据表下载