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GD32F310 数据表(PDF) 7 Page - GigaDevice Semiconductor (Beijing) Inc.

部件名 GD32F310
功能描述  Arm® Cortex®-M4 32-bit MCU
PDF  81 Pages
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制造商  GIGADEVICE [GigaDevice Semiconductor (Beijing) Inc.]
网页  http://www.gigadevice.com/
标志 GIGADEVICE - GigaDevice Semiconductor (Beijing) Inc.

GD32F310 数据表(HTML) 7 Page - GigaDevice Semiconductor (Beijing) Inc.

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GD32F310xx Datasheet
6
Table 4-28. ADC RAIN max for fADC = 36 MHz(1)
..................................................................................................57
Table 4-29. ADC dynamic accuracy at fADC = 14 MHz(1)
..................................................................................57
Table 4-30. ADC dynamic accuracy at fADC = 28 MHz(1)
..................................................................................57
Table 4-31.ADC dynamic accuracy at fADC = 36 MHz(1)
...................................................................................57
Table 4-32. ADC static accuracy at fADC = 14 MHz(1)
........................................................................................57
Table 4-33. Temperature sensor characteristics(1)
..........................................................................................58
Table 4-34. I2C characteristics(1)(2)(3)
...................................................................................................................58
Table 4-35
. Standard SPI characteristics ..........................................................................................................59
Table 4-36. I2S characteristics
.............................................................................................................................61
Table 4-37
. USART characteristics(1) ..................................................................................................................63
Table 4-38
. TIMER characteristics(1)....................................................................................................................63
Table 4-39. FWDGT min/max timeout period at 40 kHz (IRC40K)(1)
............................................................63
Table 4-40. WWDGT min-max timeout value at 36 MHz (fPCLK1)(1)
................................................................64
Table 5-1. LQFP48 package dimensions ...........................................................................................................65
Table 5-2. LQFP32 package dimensions ...........................................................................................................67
Table 5-3. QFN32 package dimensions..............................................................................................................69
Table 5-4. QFN28 package dimensions..............................................................................................................71
Table 5-5. TSSOP20 package dimensions.........................................................................................................73
Table 5-6. Package thermal characteristics(1)
...................................................................................................75
Table 6-1. Part ordering code for GD32F310xx devices
................................................................................77
Table 7-1. Revision history
...................................................................................................................................78



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