GD32F310 datasheet(76/81 Pages) GIGADEVICE

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GD32F310xx Datasheet

5.6

Thermal characteristics

Thermal resistance is used to characterize the thermal performance of the package device,

which is represented by the Greek letter “θ”. For semiconductor devices, thermal resistance

represents the steady-state temperature rise of the chip junction due to the heat dissipated

on the chip surface.

θJA: Thermal resistance, junction-to-ambient.

θJB: Thermal resistance, junction-to-board.

θJC: Thermal resistance, junction-to-case.

ᴪJB: Thermal characterization parameter, junction-to-board.

ᴪJT: Thermal characterization parameter, junction-to-top center.

θJA=(TJ-TA)/PD

(5-1)

θJB=(TJ-TB)/PD

(5-2)

θJC=(TJ-TC)/PD

(5-3)

Where, TJ = Junction temperature.

TA = Ambient temperature

TB = Board temperature

TC = Case temperature which is monitoring on package surface

PD = Total power dissipation

θJA represents the resistance of the heat flows from the heating junction to ambient air. It is

an indicator of package heat dissipation capability. Lower θJA can be considerate as better

overall thermal performance. θJA is generally used to estimate junction temperature.

θJB is used to measure the heat flow resistance between the chip surface and the PCB board.

θJC represents the thermal resistance between the chip surface and the package top case.

θJC is mainly used to estimate the heat dissipation of the system (using heat sink or other heat

dissipation methods outside the device package).

Table 5-6. Package thermal characteristics(1)

Symbol

Condition

Package

Value

Unit

θJA

Natural convection, 2S2P PCB

LQFP48

64.40

°C/W

LQFP32

66.11

QFN32

48.50

QFN28

66.07

TSSOP20

72.35

θJB

Cold plate, 2S2P PCB

LQFP48

42.32

°C/W

LQFP32

42.66

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