MPC8640DEC datasheet(90/140 Pages) FREESCALE

部件名	MPC8640DEC

功能描述	Integrated Host Processor Hardware Specifications

PDF	140 Pages

Scroll/Zoom	100%

制造商	FREESCALE [Freescale Semiconductor, Inc]

网页	http://www.freescale.com

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90 / 140 page

MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 1

Freescale Semiconductor

Package

16 Package

This section details package parameters and dimensions.

16.1

Package Parameters for the MPC8640

The package parameters are as provided in the following list. The package type is 33 mm x 33 mm, 1023

pins. There are two package options: high-lead Flip Chip-Ceramic Ball Grid Array (FC-CBGA), and

lead-free (FC-CBGA).

For all package types:

Die size

12.1 mm x 14.7 mm

Package outline

33 mm x 33 mm

Interconnects

1023

Pitch

1 mm

Total Capacitor count

43 caps; 100 nF each

For high-lead FC-CBGA (package option: HCTE1 HX)

Maximum module height

2.97 mm

Minimum module height

2.47 mm

Solder Balls

89.5% Pb 10.5% Sn

Ball diameter (typical2)

0.60 mm

For RoHS lead-free FC-CBGA (package option: HCTE1 VU)

Maximum module height

2.77 mm

Minimum module height

2.27 mm

Solder Balls

95.5% Sn 4.0% Ag 0.5% Cu

Ball diameter (typical2)

0.60 mm

1 High-coefficient of thermal expansion

2 Typical ball diameter is before reflow

MPC8640DEC 数据表(PDF) 90 Page - Freescale Semiconductor, Inc

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