ST7263BEx datasheet(171/186 Pages) STMICROELECTRONICS

部件名	ST7263BEx

功能描述	Low speed USB 8-bit MCU family with up to 32 KB Flash/ROM, DFU capability, 8-bit ADC, WDG, timer, SCI and I²C

PDF	186 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

171 / 186 page

ST7263Bxx

Package characteristics

Doc ID 7516 Rev 8

171/186

14.2

Thermal characteristics

14.3

Soldering and glueability information

Recommended glue for SMD plastic packages dedicated to molding compound with

silicone:

●

Heraeus: PD945, PD955

●

Loctite: 3615, 3298

Table 85.

Thermal characteristics

Symbol

Ratings

Value

Unit

RthJA

Package thermal resistance (junction to

ambient)

SDIP32

SO34

SO24

LQFP48

QFN40

°C/W

Power dissipation(1)

The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation

of an application can be defined by the user with the formula: PD=PINT + PPORT where PINT is the chip

internal power (IDD x VDD) and PPORT the port power dissipation depending on the ports used in the

application.

500

TJmax

Maximum junction temperature(2)

The maximum chip-junction temperature is based on technology characteristics.

150

°C

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