MPC8544E datasheet(99/117 Pages) FREESCALE

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MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5

Freescale Semiconductor

Thermal

20.3

Thermal Management Information

This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA)

package for air-cooled applications. Proper thermal control design is primarily dependent on the

system-level design—the heat sink, airflow, and thermal interface material. The MPC8544E implements

several features designed to assist with thermal management, including the temperature diode. The

temperature diode allows an external device to monitor the die temperature in order to detect excessive

temperature conditions and alert the system; see Section 20.3.4, “Temperature Diode,” for more

information.

The recommended attachment method to the heat sink is illustrated in Figure 61. The heat sink should be

attached to the printed-circuit board with the spring force centered over the die. This spring force should

not exceed 10 pounds force (45 Newton).

Figure 61. Package Exploded Cross-Sectional View with Several Heat Sink Options

The system board designer can choose between several types of heat sinks to place on the device. There

are several commercially-available heat sinks from the following vendors:

Aavid Thermalloy603-224-9988

80 Commercial St.

Concord, NH 03301

Internet: www.aavidthermalloy.com

Advanced Thermal Solutions781-769-2800

89 Access Road #27.

Norwood, MA02062

Internet: www.qats.com

Alpha Novatech408-567-8082

473 Sapena Ct. #12

Santa Clara, CA 95054

Internet: www.alphanovatech.com

Thermal Interface Material

Heat Sink

FC-PBGA Package

Heat Sink

Clip

Printed-Circuit Board

Die

Adhesive or

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